SCDS040M December   1997  – July 2018 SN74CBTLV3257

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic (Each FET Switch)
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • DBQ|16
  • RGY|16
  • D|16
  • DGV|16
  • RSV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Design Requirements

  1. Recommended Input Conditions:
    • For specified high and low levels, see VIH and VIL in Recommended Operating Conditions.
    • Inputs and outputs are overvoltage tolerant slowing them to go as high as 4.6 V at any valid VCC.
  2. Recommended Output Conditions:
    • Load currents should not exceed ±128 mA per channel.
  3. Frequency Selection Criterion:
    • Maximum frequency tested is 200 MHz.
    • Added trace resistance/capacitance can reduce maximum frequency capability; use layout practices as directed in Layout.