SCLS085K December   1982  – June 2021 SN54HC14 , SN74HC14

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     6
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 74
    6. 6.6  Electrical Characteristics - 54
    7. 6.7  Switching Characteristics - 74
    8. 6.8  Switching Characteristics - 54
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DB|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision J (October 2016) to Revision K (June 2021)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Updated to new data sheet standardsGo
  • Updated package sizing for DB package in Device Information tableGo
  • Increased D (86 to 133.6), DB (96 to 114.8), NS (76 to 122.6), and PW (113 to 151.7); decreased N (80 to 60.7) °C/WGo

Changes from Revision I (February 2016) to Revision J (October 2016)

  • Changed " Y = A" to "Y = A" throughoutGo
  • Added The SNx4HC14 to Description sectionGo
  • Deleted Device Comparison Table sectionGo
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from Revision H (September 2015) to Revision I (February 2016)

  • Changed part number from SN54HC08 to SN54HC14 in Switching Characteristics tableGo
  • Changed part number from SN54HC08 to SN54HC14 in Switching Characteristics tableGo

Changes from Revision G (January 2014) to Revision H (September 2015)

  • Added Applications Go
  • Added Military Disclaimer to Features list.Go
  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision F (December 2010) to Revision G (January 2014)

  • Updated document to new TI data sheet format - no specification changes.Go