SCLS845B September   2020  – January 2026 SN74HCS151

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1.     5
    2.     6
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
      4. 7.3.4 Wettable Flanks
    4.     26
    5. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74HCS151 D or PW Package16-Pin SOIC or TSSOPTop ViewD or PW Package
16-Pin SOIC or TSSOP
Top View
SN74HCS151 WBQB Package16-Pin WQFNTop ViewWBQB Package
16-Pin WQFN
Top View
Pin Functions
PIN TYPE(2) DESCRIPTION
NAME SOIC or TSSOP or WBQB NO.
A 11 I Address select A
B 10 I Address select B
C 9 I Address select C
D0 4 I Data input 0
D1 3 I Data input 1
D2 2 I Data input 2
D3 1 I Data input 3
D4 15 I Data input 4
D5 14 I Data input 5
D6 13 I Data input 6
D7 12 I Data input 7
G 7 I Output strobe, active low
GND 8 N/A Ground
Thermal Pad (1) N/A The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
VCC 16 N/A Positive supply
W 6 O Data output, inverted
Y 5 O Data output
(1) WBQB package only.
(2) I = Input, O = Output, N/A = not applicable