SCES336J May   2000  – January 2016 SN74LV06A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    7. 6.7  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 6.8  Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 6.9  Noise Characteristics
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DB|14
  • DGV|14
  • PW|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
VI Input voltage range(2) –0.5 7 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 7 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current VO = 0 to VCC –35 mA
Continuous current through VCC or GND ±50 mA
Tstg Storage temperature range –65 150 °C
TJ Junction Temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN54LV06A(2) SN74LV06A UNIT
MIN MAX MIN MAX
VCC Supply voltage 2 2 5.5 V
VIH High level input voltage VCC = 2 V .5 1.5 V
VCC = 2.3 V to 2.7 V VCC × 0.7 VCC × 0.7
VCC = 3 V to 3.6 V VCC × 0.7 VCC × 0.7
VCC = 4.5 V to 5.5 V VCC × 0.7 VCC × 0.7
VIL Low level input voltage VCC = 2 V 0.5 0.5 V
VCC = 2.3 V to 2.7 V VCC × 0.3 VCC × 0.3
VCC = 3 V to 3.6 V VCC × 0.3 VCC × 0.3
VCC = 4.5 V to 5.5 V VCC × 0.3 VCC × 0.3
VI Input voltage 0 5.5 0 5.5 V
VO Output voltage 0 5.5 0 5.5 V
IOL Low level output current VCC = 2 V 50 20 µA
VCC = 2.3 V to 2.7 V 2 2 mA
VCC = 3 V to 3.6 V 8 8
VCC = 4.5 V to 5.5 V 16 16
Δt/Δv Input transition rise and fall rate VCC = 2.3 V to 2.7 V 200 200 ns/V
VCC = 3 V to 3.6 V 100 100
VCC = 4.5 V to 5.5 V 20 20
TA Operating free-air temperature –55 125 –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).
(2) Product Preview.

6.4 Thermal Information

THERMAL METRIC(1) SN74LV06A UNIT
D DB DGV NS PW
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 100.6 112.5 135.2 95.4 128.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.8 65.0 57.9 52.9 57.2
RθJB Junction-to-board thermal resistance 54.9 59.9 68.3 51.2 70.7
ψJT Junction-to-top characterization parameter 25.0 25.0 9.2 17.9 9.3
ψJB Junction-to-board characterization parameter 54.7 59.3 67.6 53.8 70.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC SN74LV06A –40°C to 85°C
SN74LV06A
–40°C to 125°C
SN74LV06A
UNIT
MIN TYP MAX MIN TYP MAX
VOL IOL = 50 µA 2 V to 5.5 V 0.1 0.1 0.1 V
IOL = 2 mA 2.3 V 0.4 0.4 0.4
IOL = 8 mA 3 V 0.44 0.44 0.44
IOL = 16 mA 4.5 V 0.55 0.55 0.55
II VI = 5.5 V or GND 0 to 5.5 V ±1 ±1 ±1 µA
IOH VI = VIL, VOH = VCC 5.5 V ±2.5 ±2.5 ±2.5 µA
ICC VI = VCC or GND, IO = 0 5.5 V 20 20 20 µA
Ioff VI or VO = 0 to 5.5 V 0 5 5 5 µA
Ci VI = VCC or GND 3.3 V 1.6 1.6 1.6 pF

6.6 Switching Characteristics, VCC = 2.5 V ± 0.2 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
TA = 25°C –40°C to 85°C
SN74LV06A
–40°C to 125°C
SN74LV06A
UNIT
MIN TYP MAX MIN MAX MIN MAX
tPLH A Y CL = 15 pF 5.4(1) 10.4(1) 1(1) 13(1) 1 14 ns
tPHL 7.2(1) 10.4(1) 1(1) 13(1) 1 14
tPLH A Y CL = 50 pF 9.7 15.2 1 18 1 19 ns
tPHL A Y 9.3 15.2 1 18 1 19
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.

6.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
TA = 25°C –40°C to 85°C
SN74LV06A
–40°C to 125°C
SN74LV06A
UNIT
MIN TYP MAX MIN MAX MIN MAX
tPLH A Y CL = 15 pF 4.1(1) 7.1(1) 1(1) 8.5(1) 1 9.5 ns
tPHL A Y 4.9(1) 7.1(1) 1(1) 8.5(1) 1 9.5
tPLH A Y CL = 50 pF 7.1 10.6 1 12 1 13 ns
tPHL A Y 6.4 10.6 1 12 1 13
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.

6.8 Switching Characteristics, VCC = 5 V ± 0.5 V

operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
TA = 25°C –40°C to 85°C
SN74LV06A
–40°C to 125°C
SN74LV06A
UNIT
MIN TYP MAX MIN MAX MIN MAX
tPLH A Y CL = 15 pF 3(1) 5.5(1) 1(1) 6.5(1) 1 7 ns
tPHL A Y 3.3(1) 5.5(1) 1(1) 6.5(1) 1 7
tPLH A Y CL = 50 pF 4.8 7.5 1 8.5 1 9 ns
tPHL A Y 4.4 7.5 1 8.5 1 9
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.

6.9 Noise Characteristics(1)

VCC = 3.3 V, CL = 50 pF, TA = 25°C
PARAMETER MIN TYP MAX UNIT
VOL(P) Quiet output, maximum dynamic VOL 0.5 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.1 –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 3.3 V
VIH(D) High-level dynamic input voltage 2.31 V
VIL(D) Low-level dynamic input voltage 0.99 V
(1) Characteristics are for surface-mount packages only.

6.10 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd Power dissipation capacitance CL = 50 pF, f = 10 MHz 3.3 V 2.6 pF
5 V 4.7

6.11 Typical Characteristics

SN54LV06A SN74LV06A D001_SCES336.gif Figure 1. TPD vs Temperature at 5 V
SN54LV06A SN74LV06A D002_SCES336.gif Figure 2. TPD vs VCC at 25°C