SCLS741C November   2013  – October 2023 SN74LV1T32

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 5
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Operating Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Clamp Diode Structure
      2. 9.3.2 Balanced CMOS Push-Pull Outputs
      3. 9.3.3 LVxT Enhanced Input Voltage
        1. 9.3.3.1 Down Translation
        2. 9.3.3.2 Up Translation
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Power Supply Recommendations
    2. 10.2 Layout
      1. 10.2.1 Layout Guidelines
        1. 10.2.1.1 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support (Analog)
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.