SCES207N April   1999  – March 2019 SN74LVC2G157

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Logic Diagram (Positive Logic)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Standard CMOS Inputs
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 Negative Clamping Diodes
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power
        2. 9.2.1.2 Inputs
        3. 9.2.1.3 Outputs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from M Revision (June 2015) to N Revision

  • Changed YZP package pinout drawing to match mechanical data drawing; and, pin functions description for clarity Go
  • Added additional thermal metrics for all packages.Go
  • Added detailed feature description sections for Standard CMOS Inputs, Balanced High-Drive CMOS Push-Pull Outputs, and Negative Clamping Diodes.Go
  • Added improved Design Requirements and Detailed Design Procedure.Go
  • Changed verbiage to better reflect recommendations for this specific device rather than logic devices in general.Go
  • Added layout example for the YZP package.Go

Changes from L Revision (January 2014) to M Revision

  • Added ESD Ratings table.Go
  • Added Thermal Information table.Go
  • Added Typical CharacteristicsGo
  • Added Mechanical, Packaging, and OrderableInformation section.Go

Changes from K Revision (January 2007) to L Revision

  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information tableGo
  • Updated FeaturesGo
  • Added Device Information tableGo