SCES584B JUNE   2005  – November 2014 SN74LVC8T245

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Logic Diagram (Positive Logic)
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information DB, DBQ and DGV
    5. 8.5  Thermal Information PW and RHL
    6. 8.6  Electrical Characteristics
    7. 8.7  Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    8. 8.8  Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    9. 8.9  Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    10. 8.10 Switching Characteristics, VCCA = 5 V ± 0.5 V
    11. 8.11 Operating Characteristics
    12. 8.12 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V Power-Supply Range
      2. 10.3.2 Ioff Supports Partial-Power-Down Mode Operation
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Trademarks
    2. 14.2 Electrostatic Discharge Caution
    3. 14.3 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|24
  • DBQ|24
  • RHL|24
  • NS|24
  • DB|24
  • DW|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Description (continued)

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature ensures that if either VCC input is at GND, all outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.