SCES584B JUNE   2005  – November 2014 SN74LVC8T245

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Logic Diagram (Positive Logic)
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information DB, DBQ and DGV
    5. 8.5  Thermal Information PW and RHL
    6. 8.6  Electrical Characteristics
    7. 8.7  Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    8. 8.8  Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    9. 8.9  Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    10. 8.10 Switching Characteristics, VCCA = 5 V ± 0.5 V
    11. 8.11 Operating Characteristics
    12. 8.12 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V Power-Supply Range
      2. 10.3.2 Ioff Supports Partial-Power-Down Mode Operation
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Trademarks
    2. 14.2 Electrostatic Discharge Caution
    3. 14.3 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|24
  • DBQ|24
  • RHL|24
  • NS|24
  • DB|24
  • DW|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Device and Documentation Support

14.1 Trademarks

All other trademarks are the property of their respective owners.

14.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

14.3 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.