SNLS693B December   2021  – December 2023 SN75LVPE5412

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 DC Electrical Characteristics
    6. 5.6 High Speed Electrical Characteristics
    7. 5.7 SMBUS/I2C Timing Characteristics
    8. 5.8 Typical Characteristics
    9. 5.9 Typical Jitter Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Five-Level Control Inputs
      2. 6.3.2 Linear Equalization
      3. 6.3.3 Flat Gain
      4. 6.3.4 Receiver Detect State Machine
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active PCIe Mode
      2. 6.4.2 Active Buffer Mode
      3. 6.4.3 Standby Mode
    5. 6.5 Programming
      1. 6.5.1 Pin Mode
      2. 6.5.2 SMBUS/I2C Register Control Interface
        1. 6.5.2.1 Shared Registers
        2. 6.5.2.2 Channel Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 PCIe x8 Lane Switching
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 Protocol Agnostic Linear Redriver for High Speed Interfaces
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUA|42
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.1.2 Detailed Design Procedure

In PCIe Gen 3.0, 4.0, and 5.0 applications, the specification requires RX-TX link training to establish and optimize signal conditioning settings at 8.0, 16.0, and 32.0Gbps, respectively. In link training, the RX partner requests a series of FIR – pre-shoot and de-emphasis coefficients (10 presets) from the TX partner. The RX partner includes CTLE and DFE. The link training would pre-condition the signal, with an equalized link between the Root Complex and Endpoint.

Note: there is no link training in PCIe Gen 1.0 (2.5Gbps) or PCIe Gen 2.0 (5.0Gbps) applications. The SN75LVPE5412 is placed in between the TX and RX. It helps extend the PCB trace reach distance by boosting the attenuated signals with its equalization, which allows the user to recover the signal by the downstream RX more easily.

For operation in Gen 5.0, 4.0, and 3.0 links, the SN75LVPE5412 transmit outputs are designed to pass the TX Preset signaling onto the RX for the PCIe Gen 5.0, 4.0, and 3.0 link to train and optimize the equalization settings. The suggested setting for the device is GAIN = L4 (default). Adjustments to the EQ setting should be performed based on the channel loss to optimize the eye opening in the RX partner. The TX equalization presets or CTLE and DFE coefficients in the RX can also be adjusted to further improve the eye opening.