SLAS931 October   2017 TAS5634

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Audio Specification Stereo (BTL)
    6. 7.6 Audio Specifications Mono (PBTL)
    7. 7.7 Audio Specification 4 Channels (SE)
    8. 7.8 Electrical Characteristics
    9. 7.9 Typical Characteristics
      1. 7.9.1 BTL Configuration
      2. 7.9.2 PBTL Configuration
      3. 7.9.3 SE Configuration
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Closed-Loop Architecture
      2. 8.3.2  Power Supplies
        1. 8.3.2.1 BST, Bootstrap Supply
        2. 8.3.2.2 PVDD, Output Stage Power Supply
        3. 8.3.2.3 GVDD, Gate-Drive Power Supply
        4. 8.3.2.4 VDD Supply, Internal Regulators (DVDD and AVDD)
      3. 8.3.3  System Power-Up / Power-Down Sequence
        1. 8.3.3.1 Powering Up
        2. 8.3.3.2 Powering Down
      4. 8.3.4  Startup and Shutdown Ramp Sequence (C_START)
      5. 8.3.5  Device Protection System
      6. 8.3.6  Overload and Short Circuit Current Protection
      7. 8.3.7  DC Speaker Protection
      8. 8.3.8  Pin-To-Pin Short Circuit Protection (PPSC)
      9. 8.3.9  Overtemperature Protection
      10. 8.3.10 Overtemperature Warning, OTW
      11. 8.3.11 Undervoltage Protection (UVP) and Power-On Reset (POR)
      12. 8.3.12 Error Reporting
      13. 8.3.13 Fault Handling
      14. 8.3.14 System Design Consideration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Stereo, Bridge-tied Load (BTL)
      2. 8.4.2 Mono, Paralleled Bridge-tied Load (PBTL)
      3. 8.4.3 4-Channel, Single-ended (SE)
      4. 8.4.4 BD Modulation
      5. 8.4.5 Device Reset
      6. 8.4.6 Unused Output Channels
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical BTL Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Pin Connections
        4. 9.2.1.4 Application Curves
      2. 9.2.2 Typical PBTL Configuration
        1. 9.2.2.1 Application Curves
      3. 9.2.3 Typical SE Configuration
        1. 9.2.3.1 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supplies
    2. 10.2 Bootstrap Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material Recommendation
      2. 11.1.2 PVDD Capacitor Recommendation
      3. 11.1.3 Decoupling Capacitor Recommendation
      4. 11.1.4 Circuit Component Requirements
      5. 11.1.5 Printed Circuit Board Requirements
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information