SLASFD8 May   2025 TAS5830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
      1. 5.7.1 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
      2. 5.7.2 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation
      3. 5.7.3 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
      4. 5.7.4 Parallel Bridge Tied Load (PBTL) Configuration With 1SPW Modulation
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Supplies
      2. 6.3.2 Device Clocking
      3. 6.3.3 Serial Audio Port – Clock Rates
      4. 6.3.4 Clock Halt Auto-recovery
      5. 6.3.5 Sample Rate on the Fly Change
      6. 6.3.6 Serial Audio Port - Data Formats and Bit Depths
    4. 6.4 Device Functional Modes
      1. 6.4.1 Software Control
      2. 6.4.2 Speaker Amplifier Operating Modes
        1. 6.4.2.1 BTL Mode
        2. 6.4.2.2 PBTL Mode
      3. 6.4.3 Low EMI Modes
        1. 6.4.3.1 Spread Spectrum
        2. 6.4.3.2 Channel to Channel Phase Shift
        3. 6.4.3.3 Multi-Devices PWM Phase Synchronization
          1. 6.4.3.3.1 Phase Synchronization With I2S Clock In Startup Phase
          2. 6.4.3.3.2 Phase Synchronization With GPIO
      4. 6.4.4 Thermal Foldback
      5. 6.4.5 Device State Control
      6. 6.4.6 Device Modulation
        1. 6.4.6.1 BD Modulation
        2. 6.4.6.2 1SPW Modulation
        3. 6.4.6.3 Hybrid Modulation
      7. 6.4.7 Programming and Control
        1. 6.4.7.1 I2C Serial Communication Bus
        2. 6.4.7.2 Hardware Control Mode
        3. 6.4.7.3 I2C Target Address
          1. 6.4.7.3.1 Random Write
          2. 6.4.7.3.2 Sequential Write
          3. 6.4.7.3.3 Random Read
          4. 6.4.7.3.4 Sequential Read
          5. 6.4.7.3.5 DSP Memory Book, Page and BQ update
          6. 6.4.7.3.6 Checksum
            1. 6.4.7.3.6.1 Cyclic Redundancy Check (CRC) Checksum
            2. 6.4.7.3.6.2 Exclusive or (XOR) Checksum
        4. 6.4.7.4 Control via Software
          1. 6.4.7.4.1 Startup Procedures
          2. 6.4.7.4.2 Shutdown Procedures
        5. 6.4.7.5 Protection and Monitoring
          1. 6.4.7.5.1 Overcurrent Limit (Cycle-By-Cycle)
          2. 6.4.7.5.2 Overcurrent Shutdown (OCSD)
          3. 6.4.7.5.3 DC Detect Error
          4. 6.4.7.5.4 Overtemperature Shutdown (OTSD)
          5. 6.4.7.5.5 PVDD Overvoltage and Undervoltage Error
          6. 6.4.7.5.6 PVDD Drop Detection
          7. 6.4.7.5.7 Clock Fault
  8. 7 Register Maps
    1. 7.1 reg_map Registers
  9. 8 Application and Implementation
    1. 8.1 Typical Applications
      1. 8.1.1 2.0 (Stereo BTL) System
      2. 8.1.2 Mono (PBTL) Systems
    2. 8.2 Power Supply Recommendations
      1. 8.2.1 DVDD Supply
      2. 8.2.2 PVDD Supply
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 General Guidelines for Audio Amplifiers
        2. 8.3.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
        3. 8.3.1.3 Optimizing Thermal Performance
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.4 Thermal Foldback

The Thermal Foldback (TFB), is designed to protect TAS5830 from excessive die temperature increases, in case the device operates beyond the recommended temperature/power limit, or with a weaker thermal system design than recommended. The TFB allows the TAS5830 to play as loud as possible without triggering unexpected thermal shutdown. TAS5830 has four over-temperature warning (OTW) thresholds, each threshold is indicated in I2C register 0x73 bits 0, 1, 2, and 3. An internal Automatic Gain Limiter (AGL) gradually reduces the digital gain when the OTW value increases in temperature from level 1 (lowest OTW temperature) to level 4 (highest OTW temperature). The gain attenuation applied is proportional to OTW level, with lower OTW levels resulting in lower attenuation and higher OTW levels resulting in higher attenuation. When die temperature decreases and the OTW level reduces, the digital signal gain gradually increases until the temperature falls below the OTW level and digital gain is restored to the original level. Both the attenuation gain and adjustable rate are programmable. The TFB gain regulation speed (attack rate and release rate) settings are the same as a regular AGL, which is also configurable with TAS5830 App in PurePathTM Console3.