SLOSE32A April   2019  – October 2019 TAS6421-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Serial Audio Port
        1. 9.3.1.1 I2S Mode
        2. 9.3.1.2 Left-Justified Timing
        3. 9.3.1.3 Right-Justified Timing
        4. 9.3.1.4 TDM Mode
        5. 9.3.1.5 Supported Clock Rates
        6. 9.3.1.6 Audio-Clock Error Handling
      2. 9.3.2  DC Blocking
      3. 9.3.3  Volume Control and Gain
      4. 9.3.4  High-Frequency Pulse-Width Modulator (PWM)
      5. 9.3.5  Gate Drive
      6. 9.3.6  Power FETs
      7. 9.3.7  Load Diagnostics
        1. 9.3.7.1 DC Load Diagnostics
        2. 9.3.7.2 Line Output Diagnostics
        3. 9.3.7.3 AC Load Diagnostics
          1. 9.3.7.3.1 Impedance Magnitude Measurement
          2. 9.3.7.3.2 Impedance Phase Reference Measurement
          3. 9.3.7.3.3 Impedance Phase Measurement
      8. 9.3.8  Protection and Monitoring
        1. 9.3.8.1 Overcurrent Limit (ILIMIT)
        2. 9.3.8.2 Overcurrent Shutdown (ISD)
        3. 9.3.8.3 DC Detect
        4. 9.3.8.4 Clip Detect
        5. 9.3.8.5 Global Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD)
        6. 9.3.8.6 Channel Overtemperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 9.3.8.7 Undervoltage (UV) and Power-On-Reset (POR)
        8. 9.3.8.8 Overvoltage (OV) and Load Dump
      9. 9.3.9  Power Supply
        1. 9.3.9.1 Vehicle-Battery Power-Supply Sequence
          1. 9.3.9.1.1 Power-Up Sequence
          2. 9.3.9.1.2 Power-Down Sequence
        2. 9.3.9.2 Boosted Power-Supply Sequence
      10. 9.3.10 Hardware Control Pins
        1. 9.3.10.1 FAULT
        2. 9.3.10.2 WARN
        3. 9.3.10.3 MUTE
        4. 9.3.10.4 STANDBY
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes and Faults
    5. 9.5 Programming
      1. 9.5.1 I2C Serial Communication Bus
      2. 9.5.2 I2C Bus Protocol
      3. 9.5.3 Random Write
      4. 9.5.4 Sequential Write
      5. 9.5.5 Random Read
      6. 9.5.6 Sequential Read
    6. 9.6 Register Maps
      1. 9.6.1  Mode Control Register (address = 0x00) [default = 0x00]
        1. Table 9. Mode Control Field Descriptions
      2. 9.6.2  Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
        1. Table 10. Misc Control 1 Field Descriptions
      3. 9.6.3  Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
        1. Table 11. Misc Control 2 Field Descriptions
      4. 9.6.4  SAP Control (Serial Audio-Port Control) Register (address = 0x03) [default = 0x04]
        1. Table 12. SAP Control Field Descriptions
      5. 9.6.5  Channel State Control Register (address = 0x04) [default = 0x55]
        1. Table 13. Channel State Control Field Descriptions
      6. 9.6.6  Channel 1 Volume Control Register (address = 0x05) [default = 0xCF]
        1. Table 14. Ch 1 Volume Control Field Descriptions
      7. 9.6.7  DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
        1. Table 15. DC Load Diagnostics Control 1 Field Descriptions
      8. 9.6.8  DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
        1. Table 16. DC Load Diagnostics Control 2 Field Descriptions
      9. 9.6.9  DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
        1. Table 17. DC Load Diagnostics Report 1 Field Descriptions
      10. 9.6.10 DC Load Diagnostics Report 3 Line Output Register (address = 0x0E) [default = 0x00]
        1. Table 18. DC Load Diagnostics Report 3 Line Output Field Descriptions
      11. 9.6.11 Channel State Reporting Register (address = 0x0F) [default = 0x40]
        1. Table 19. State-Reporting Field Descriptions
      12. 9.6.12 Channel Faults (Overcurrent, DC Detection) Register (address = 0x10) [default = 0x00]
        1. Table 20. Channel Faults Field Descriptions
      13. 9.6.13 Global Faults 1 Register (address = 0x11) [default = 0x00]
        1. Table 21. Global Faults 1 Field Descriptions
      14. 9.6.14 Global Faults 2 Register (address = 0x12) [default = 0x00]
        1. Table 22. Global Faults 2 Field Descriptions
      15. 9.6.15 Warnings Register (address = 0x13) [default = 0x20]
        1. Table 23. Warnings Field Descriptions
      16. 9.6.16 Pin Control Register (address = 0x14) [default = 0x00]
        1. Table 24. Pin Control Field Descriptions
      17. 9.6.17 AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
        1. Table 25. AC Load Diagnostic Control 1 Field Descriptions
      18. 9.6.18 AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
        1. Table 26. AC Load Diagnostic Control 2 Field Descriptions
      19. 9.6.19 AC Load Diagnostic Impedance Report Ch1 Register (address = 0x17) [default = 0x00]
        1. Table 27. Ch1 AC LDG Impedance Report Field Descriptions
      20. 9.6.20 AC Load Diagnostic Phase Report High Register (address = 0x1B) [default = 0x00]
        1. Table 28. AC LDG Phase High Report Field Descriptions
      21. 9.6.21 AC Load Diagnostic Phase Report Low Register (address = 0x1C) [default = 0x00]
        1. Table 29. AC LDG Phase Low Report Field Descriptions
      22. 9.6.22 AC Load Diagnostic STI Report High Register (address = 0x1D) [default = 0x00]
        1. Table 30. AC LDG STI High Report Field Descriptions
      23. 9.6.23 AC Load Diagnostic STI Report Low Register (address = 0x1E) [default = 0x00]
        1. Table 31. Ch1 AC LDG STI Low Report Field Descriptions
      24. 9.6.24 Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
        1. Table 32. Misc Control 3 Field Descriptions
      25. 9.6.25 Clip Control Register (address = 0x22) [default = 0x01]
        1. Table 33. Clip Control Field Descriptions
      26. 9.6.26 Clip Window Register (address = 0x23) [default = 0x14]
        1. Table 34. Clip Window Field Descriptions
      27. 9.6.27 Clip Warning Register (address = 0x24) [default = 0x00]
        1. Table 35. Clip Warning Field Descriptions
      28. 9.6.28 ILIMIT Status Register (address = 0x25) [default = 0x00]
        1. Table 36. ILIMIT Status Field Descriptions
      29. 9.6.29 Miscellaneous Control 4 Register (address = 0x26) [default = 0x40]
        1. Table 37. Misc Control 4 Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 AM-Radio Band Avoidance
      2. 10.1.2 Demodulation Filter Design
      3. 10.1.3 Line Driver Applications
    2. 10.2 Typical Applications
      1. 10.2.1 BTL Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 Communication
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Hardware Design
          2. 10.2.1.2.2 Digital Input and the Serial Audio Port
          3. 10.2.1.2.3 Bootstrap Capacitors
          4. 10.2.1.2.4 Output Reconstruction Filter
      2. 10.2.2 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Electrical Connection of Thermal pad and Heat Sink
      2. 12.1.2 EMI Considerations
      3. 12.1.3 General Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

Test conditions (unless otherwise noted): TC = 25°C, PVDD = VBAT = 14.4 V, VDD = 3.3 V, RL = 4 Ω, Pout = 1 W/ch, fIN = 1 kHz, fSW = 2.11 MHz, AES17 Filter, default I2C settings
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OPERATING CURRENT
IPVDD_IDLE PVDD idle current Channel playing, no audio input 17 23 mA
IVBAT_IDLE VBAT idle current Channel playing, no audio input 28 32 mA
IPVDD_STBY PVDD standby current STANDBY Active, VDD = 0 V 0.5 1 µA
IVBAT_STBY VBAT standby current STANDBY Active, VDD = 0 V 4 6 µA
IVDD VDD supply current Channel playing, –60-dB signal 15 18 mA
OUTPUT POWER
PO_BTL Output power per channel, BTL 4 Ω, PVDD = 14.4 V, THD+N = 1%, TC = 75°C 20 22 W
4 Ω, PVDD = 14.4 V, THD+N = 10%, TC = 75°C 25 27
2 Ω, PVDD = 14.4 V, THD+N = 1%, TC = 75°C 38 40
2 Ω, PVDD = 14.4 V, THD+N = 10%, TC = 75°C 42 45
4 Ω, PVDD = 25 V, THD+N = 1%, TC = 75°C 50 55
4 Ω, PVDD = 25 V, THD+N = 10%, TC = 75°C 70 75
EFFP Power efficiency 1 channel operating at 25-W output power, 4 Ω load, PVDD = 14.4 V, TC = 25°C, including inductor losses 86%
AUDIO PERFORMANCE
Vn Output noise voltage Zero input, A-weighting, gain level 1, PVDD = 14.4 V 42 µV
Zero input, A-weighting, gain level 2, PVDD = 14.4 V 55
Zero input, A-weighting, gain level 3, PVDD = 18 V 67
Zero input, A-weighting, gain level 4, PVDD = 25 V 85
GAIN Peak Output Voltage/dBFS gain level 1, Register 0x01, bit 1-0 = 00 7.5 V/FS
gain level 2, Register 0x01, bit 1-0 = 01 15
gain level 3, Register 0x01, bit 1-0 = 10 21
gain level 4, Register 0x01, bit 1-0 = 11 29
PSRR Power-supply rejection ratio PVDD = 14.4 Vdc + 1 VRMS, f = 1 kHz 75 dB
THD+N Total harmonic distortion + noise 0.02%
LINE OUTPUT PERFORMANCE
Vn_LINEOUT LINE output noise voltage Zero input, A-weighting, channel set to LINE MODE 42 µV
VO_LINEOUT LINE output voltage 0dB input, channel set to LINE MODE 5.5 VRMS
THD+N Line output total harmonic distortion + noise VO = 2 VRMS, channel set to LINE MODE 0.01%
DIGITAL INPUT PINS
VIH Input logic level high 70 %VDD
VIL Input logic level low 30 %VDD
IIH Input logic current, high VI = VDD 15 µA
IIL Input logic current, low VI = 0 -15 µA
PWM OUTPUT STAGE
RDS(on) FET drain-to-source resistance Not including bond wire and package resistance 90 mΩ
OVERVOLTAGE (OV) PROTECTION
VPVDD_OV PVDD overvoltage shutdown 27.0 27.8 28.8 V
VPVDD_OV_HYS PVDD overvoltage shutdown hysteresis 0.8 V
VVBAT_OV VBAT overvoltage shutdown 20 21.5 23 V
VVBAT_OV_HYS VBAT overvoltage shutdown hysteresis 0.6 V
UNDERVOLTAGE (UV) PROTECTION
VBATUV VBAT undervoltage shutdown 4 4.5 V
VBATUV_HYS VBAT undervoltage shutdown hysteresis 0.2 V
PVDDUV PVDD undervoltage shutdown 4 4.5 V
PVDDUV_HYS PVDD undervoltage shutdown hysteresis 0.2 V
BYPASS VOLTAGES
VGVDD Gate drive bypass pin voltage 7 V
VAVDD Analog bypass pin voltage 6 V
VVCOM Common bypass pin voltage 2.5 V
VVREG Regulator bypass pin voltage 5.5 V
POWER-ON RESET (POR)
VPOR VDD voltage for POR 2.1 2.7 V
VPOR_HYS VDD POR recovery hysteresis voltage 0.5 V
OVERTEMPERATURE (OT) PROTECTION
OTW(i) Channel overtemperature warning 150 °C
OTSD(i) Channel overtemperature shutdown 175 °C
OTW Global junction overtemperature warning 130 °C
OTSD Global junction overtemperature shutdown 160 °C
OTHYS Overtemperature hysteresis 15 °C
LOAD OVERCURRENT PROTECTION
ILIM Overcurrent cycle-by-cycle limit OC Level 1 4.0 4.8 A
OC Level 2 6.0 6.5 A
ISD Overcurrent shutdown OC Level 1, Any short to supply, ground, or other channels 7 A
OC Level 2, Any short to supply, ground, or other channels 9 A
MUTE MODE
GMUTE Output attenuation 100 dB
CLICK AND POP
VCP Output click and pop voltage ITU-R 2k filter, High-Z/MUTE to Play, Play to Mute/High-Z 7 mV
DC OFFSET
VOFFSET Output offset voltage 2 5 mV
DC DETECT
DCFAULT Output DC fault protection 2 2.5 V
DIGITAL OUTPUT PINS
VOH Output voltage for logic level high I = ±2 mA 90 %VDD
VOL Output voltage for logic level low I = ±2 mA 10 %VDD
tDELAY_CLIPDET Signal delay when output clipping detected 20 µs
LOAD DIAGNOSTICS
S2P Resistance to detect a short from OUT pin(s) to PVDD 500 Ω
S2G Resistance to detect a short from OUT pin(s) to ground 200 Ω
SL Shorted load detection tolerance ±0.5 Ω
OL Open load 40 70 Ω
TDC_DIAG DC diagnostic time 100 ms
LO Line output diagnostic detection 6 kΩ
TLINE_DIAG Line output diagnostic time Not including the preceeding DC_DIAG time 40 ms
ACIMP AC impedance accuracy Gain linearity, ƒ = 19 kHz, RL = 2 Ω to 16 Ω 25%
ACIMP AC impedance accuracy Offset ±0.5 Ω
TAC_DIAG AC diagnostic time 170 ms
I2C_ADDR PINS
tI2C_ADDR Time delay needed for I2C address set-up 300 µs
I2C CONTROL PORT
tBUS Bus free time between a STOP and START condition 1.3 µs
th1 Hold time, SCL to SDA 0 ns
th2 Hold time, start condition to SCL 0.6 µs
tSTART I2C startup time after VDD power on reset 12 ms
tRISE Rise time, SCL and SDA 300 ns
tFALL Fall time, SCL and SDA 300 ns
tSU1 Setup, SDA to SCL 100 ns
tSU2 Setup, SCL to start condition 0.6 µs
tSU3 Setup, SCL to stop condition 0.6 µs
tW(H) Required pulse duration SCL High 0.6 µs
tW(L) Required pulse duration SCL Low 1.3 µs
SERIAL AUDIO PORT
DMCLK, DSCLK Allowable input clock duty cycle 45% 50% 55%
fMCLK Supported MCLK frequencies 128, 256, or 512 128 512 xFS
fMCLK_Max Maximum frequency 25 MHz
tSCY SCLK pulse cycle time 40 ns
tSCL SCLK pulse-with LOW 16 ns
tSCH SCLK pulse-with HIGH 16 ns
tRISE/FALL Rise and fall time <5 ns
tSF SCLK rising edge to FSYNC edge 8 ns
tFS FSYNC rising edge to SCLK edge 8 ns
tDS DATA set-up time 8 ns
tDH DATA hold time 8 ns
ci Input capacitance, pins MCLK, SCLK, FSYNC, SDIN1 10 pf
TLA Latency from input to output measured in FSYNC sample count FSYNC = 44.1 kHz or 48 kHz 30
FSYNC = 96 kHz 12