SCPS193D July   2010  – January 2023 TCA6424A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Reset Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Voltage Translation
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 I2C Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Address
    5. 8.5 Programming
      1. 8.5.1 Power-On Reset
      2. 8.5.2 Reset Input ( RESET)
      3. 8.5.3 Interrupt Output ( INT)
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Writes
        2. 8.5.4.2 Reads
    6. 8.6 Register Maps
      1. 8.6.1 Control Register and Command Byte
      2. 8.6.2 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Detailed Design Procedure
        1. 9.1.1.1 Minimizing ICC When I/Os Control LEDs
    2. 9.2 Power Supply Recommendation
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
      1.      Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TCA6424AUNIT
RGJ (UQFN)
32 PINS
RθJAJunction-to-ambient thermal resistance44.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance14.3°C/W
RθJBJunction-to-board thermal resistance17.7°C/W
ψJTJunction-to-top characterization parameter0.3°C/W
ψJBJunction-to-board characterization parameter17.7°C/W
RθJC(bottom)Junction-to-case (bottom) thermal resistance9.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.