SCPS193C July   2010  – April 2014 TCA6424A

PRODUCTION DATA.  

  1. Features
  2. Description
  3. Revision History
  4. Description (continued)
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 I2C Interface Timing Requirements
    6. 6.6 Reset Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Voltage Translation
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 I2C Interface
      3. 8.3.3 Device Address
    4. 8.4 Programming
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Reset Input (RESET)
      3. 8.4.3 Interrupt Output (INT)
      4. 8.4.4 Bus Transactions
        1. 8.4.4.1 Writes
        2. 8.4.4.2 Reads
    5. 8.5 Register Maps
      1. 8.5.1 Control Register and Command Byte
      2. 8.5.2 Register Descriptions
  9. Applications and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Minimizing ICC When I/Os Control LEDs
  10. 10Power Supply Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCCI Supply voltage range –0.5 6.5 V
VCCP Supply voltage range –0.5 6.5 V
VI Input voltage range(2) –0.5 6.5 V
VO Output voltage range(2) –0.5 6.5 V
IIK Input clamp current ADDR, RESET, SCL VI < 0 ±20 mA
IOK Output clamp current INT VO < 0 ±20 mA
IIOK Input/output clamp current P port VO < 0 or VO > VCCP ±20 mA
SDA VO < 0 or VO > VCCI ±20
IOL Continuous output low current P port VO = 0 to VCCP 25 mA
SDA, INT VO = 0 to VCCI 15
IOH Continuous output high current P port VO = 0 to VCCP 25 mA
ICC Continuous current through GND 200 mA
Continuous current through VCCP 160
Continuous current through VCCI 10
θJA Package thermal impedance(3) RGJ package 50.05 °C/W
RSM package TBD
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 01 kV
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as 2000 V may actually have higher performance.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCCI Supply voltage 1.65 5.5 V
VCCP Supply voltage 1.65 5.5 V
VIH High-level input voltage SCL, SDA 0.7 × VCCI VCCI V
RESET 0.7 × VCCI 5.5
ADDR, P27–P00 0.7 × VCCP 5.5
VIL Low-level input voltage SCL, SDA, RESET –0.5 0.3 × VCCI V
ADDR, P27–P00 –0.5 0.3 × VCCP
IOH High-level output current P27–P00 10 mA
IOL Low-level output current P27–P00 25 mA
TA Operating free-air temperature –40 85 °C

6.4 Electrical Characteristics

over recommended operating free-air temperature range, VCCI = 1.65 V to 5.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS VCCP MIN TYP(1) MAX UNIT
VIK Input diode clamp voltage II = –18 mA 1.65 V to 5.5 V –1.2 V
VPOR Power-on reset voltage VI = VCCP or GND, IO = 0 1.65 V to 5.5 V 1 1.4 V
VOH P-port high-level output voltage IOH = –8 mA 1.65 V 1.2 V
2.3 V 1.8
3 V 2.6
4.5 V 4.1
IOH = –10 mA 1.65 V 1
2.3 V 1.7
3 V 2.5
4.5 V 4.0
VOL P-port low-level output voltage IOL = 8mA 1.65 V 0.45 V
2.3 V 0.25
3 V 0.25
4.5 V 0.23
IOL = 10 mA 1.65 V 0.6
2.3 V 0.3
3 V 0.25
4.5 V 0.24
IOL SDA VOL = 0.4 V 1.65 V to 5.5 V 3 mA
INT VOL = 0.4 V 1.65 V to 5.5 V 3 15
II SCL, SDA, RESET VI = VCCI or GND 1.65 V to 5.5 V ±0.1 μA
ADDR VI = VCCP or GND ±0.1
IIH P port VI = VCCP 1.65 V to 5.5 V 1 μA
IIL P port VI = GND 1 μA
ICC
(ICCP + ICCI)
Operating mode SDA,
P port,
ADDR,
RESET
VI on SDA and RESET= VCCI or GND,
VI on P port and ADDR = VCCP,
IO = 0, I/O = inputs,
fSCL = 400 kHz
1.65 V to 5.5 V 8 30 μA
SDA,
P port,
ADDR,
RESET
VI on SDA and RESET= VCCI or GND,
VI on P port and ADDR = VCCP,
IO = 0, I/O = inputs,
fSCL = 100 kHz
1.65 V to 5.5 V 1.7 10
Standby mode SCL,
SDA,
P port,
ADDR,
RESET
VI on SCL, SDA and RESET = VCCI or GND,
VI on P port and ADDR = VCCP,
IO = 0, I/O = inputs,
fSCL = 0
1.65 V to 5.5 V 0.1 3
ΔICCI Additional current in Standby mode SCL,SDA
RESET
One input at VCCI – 0.6 V,
Other inputs at VCCI or GND
1.65 V to 5.5 V 25 μA
ΔICCP P port,
ADDR,
One input at VCCP – 0.6 V,
Other inputs at VCCP or GND
60
CI SCL VI = VCCI or GND 1.65 V to 5.5 V 6 7 pF
Cio SDA VIO = VCCI or GND 1.65 V to 5.5 V 7 8 pF
P port VIO = VCCP or GND 7.5 8.5
(1) Except for ICC, all typical values are at nominal supply voltage (VCCP = VCCI =1.8-V, 2.5-V, 3.3-V, or 5-V VCC) and TA = 25°C. For ICC, all typical values are at VCCP = VCCI = 3.3 V and TA = 25°C.

6.5 I2C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 14)
STANDARD MODE
I2C BUS
FAST MODE
I2C BUS
UNIT
MIN MAX MIN MAX
fscl I2C clock frequency 0 100 0 400 kHz
tsch I2C clock high time 4 0.6 μs
tscl I2C clock low time 4.7 1.3 μs
tsp I2C spike time 0 50 0 50 ns
tsds I2C serial data setup time 250 100 ns
tsdh I2C serial data hold time 0 0 ns
ticr I2C input rise time 1000 20 + 0.1Cb(1) 300 ns
ticf I2C input fall time 300 20 + 0.1Cb(1) 300 ns
tocf I2C output fall time; 10 pF to 400 pF bus 300 20 + 0.1Cb(1) 300 μs
tbuf I2C bus free time between Stop and Start 4.7 1.3 μs
tsts I2C Start or repeater Start condition setup time 4.7 0.6 μs
tsth I2C Start or repeater Start condition hold time 4 0.6 μs
tsps I2C Stop condition setup time 4 0.6 μs
tvd(data) Valid data time; SCL low to SDA output valid 1 1 μs
tvd(ack) Valid data time of ACK condition; ACK signal from SCL low to SDA (out) low 1 1 μs
(1) Cb = total capacitance of one bus line in pF

6.6 Reset Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 17)
STANDARD MODE
I2C BUS
FAST MODE
I2C BUS
UNIT
MIN MAX MIN MAX
tW Reset pulse duration 4 4 ns
tREC Reset recovery time 0 0 ns
tRESET Time to reset(1) 600 600 ns
(1) Minimum time for SDA to become high or minimum time to wait before doing a START.

6.7 Switching Characteristics

over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 14)
PARAMETER FROM TO STANDARD MODE
I2C BUS
FAST MODE
I2C BUS
UNIT
MIN MAX MIN MAX
tIV Interrupt valid time P port INT 4 4 μs
tIR Interrupt reset delay time SCL INT 4 4 μs
tPV Output data valid SCL P27–P00 400 400 ns
tPS Input data setup time P port SCL 0 0 ns
tPH Input data hold time P port SCL 300 300 ns

6.8 Typical Characteristics

TA = 25°C (unless otherwise noted)
g_icc_ta.gifFigure 1. Supply Current vs Temperature
g_icc_vcc.gifFigure 3. Supply Current vs Supply Voltage
g_io_snk_i_vol_25.gifFigure 5. I/O Sink Current vs Output Low Voltage
g_io_snk_i_vol_5.gifFigure 7. I/O Sink Current vs Output Low Voltage
g_io_src_i_voh_18.gifFigure 9. I/O Source Current vs Output High Voltage
g_io_src_i_voh_33.gifFigure 11. I/O Source Current vs Output High Voltage
g_io_vh_ta.gifFigure 13. I/O High Voltage vs Temperature
g_icc_stdby_ta.gifFigure 2. Standby Supply Current vs Temperature
g_io_snk_i_vol_18.gifFigure 4. I/O Sink Current vs Output Low Voltage
g_io_snk_i_vol_33.gifFigure 6. I/O Sink Current vs Output Low Voltage
g_io_vol_ta.gifFigure 8. I/O Low Voltage vs Temperature
g_io_src_i_voh_25.gifFigure 10. I/O Source Current vs Output High Voltage
g_io_src_i_voh_5.gifFigure 12. I/O Source Current vs Output High Voltage