SCPS200E July   2009  – April 2019 TCA9555

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 5-V Tolerant I/O Ports
      2. 9.3.2 Hardware Address Pins
      3. 9.3.3 Interrupt (INT) Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-On Reset (POR)
      2. 9.4.2 Powered-Up
    5. 9.5 Programming
      1. 9.5.1 I/O Port
      2. 9.5.2 I2C Interface
        1. 9.5.2.1 Bus Transactions
          1. 9.5.2.1.1 Writes
          2. 9.5.2.1.2 Reads
      3. 9.5.3 Device Address
      4. 9.5.4 Control Register and Command Byte
    6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Calculating Junction Temperature and Power Dissipation
        2. 10.2.2.2 Minimizing ICC When I/O Is Used to Control LED
        3. 10.2.2.3 Pull-Up Resistor Calculation
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from D Revision (July 2016) to E Revision

  • Changed the Device Information tableGo
  • Changed the Pin Configuration images Go

Changes from C Revision (June 2016) to D Revision

  • Added DB Package to the Device Information tableGo

Changes from A Revision (July 2009) to B Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from B Revision (July 2015) to C Revision

  • Added RGE Package to the Device Information tableGo
  • Changed VIH for I2C pins limited to VCC, with note allowing higher voltage Go
  • Added IOL for different TjGo
  • Removed ΔICC spec from the Electrical Characteristics table, added ΔICC typical characteristics graph Go
  • Changed ICC standby into different input statesGo
  • Changed Cio maximum Go
  • Changed Typical characteristic plots with updated dataGo
  • POR requirements, bounded lowest voltage allowed during glitch Go