SCPS290B April   2024  – September 2025 TCAL6416R

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 I2C Bus Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Translation
      2. 7.3.2 I/O Port
      3. 7.3.3 Adjustable Output Drive Strength
      4. 7.3.4 Interrupt Output (INT)
      5. 7.3.5 Reset Input (RESET)
      6. 7.3.6 Software Reset Call
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
    6. 7.6 Register Maps
      1. 7.6.1 Device Address
      2. 7.6.2 Multiple Power-Up Default Conditions
      3. 7.6.3 Control Register and Command Byte
      4. 7.6.4 Register Descriptions
      5. 7.6.5 Bus Transactions
        1. 7.6.5.1 Writes
        2. 7.6.5.2 Reads
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Minimizing ICC When I/Os Control LEDs
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DTO|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) Package UNIT
DTO (X2QFN)
PINS
RθJA Junction-to-ambient thermal resistance 150.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.1 °C/W
RθJB Junction-to-board thermal resistance 89.4 °C/W
ΨJT Junction-to-top characterization parameter 1.0 °C/W
ΨJB Junction-to-board characterization parameter 89.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.