SLLSES9C February   2016  – March 2019 TCAN1042-Q1 , TCAN1042G-Q1 , TCAN1042GV-Q1 , TCAN1042H-Q1 , TCAN1042HG-Q1 , TCAN1042HGV-Q1 , TCAN1042HV-Q1 , TCAN1042V-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Functional Block Diagram
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, Specifications
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Rating
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 9.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

ESD Ratings

TEST CONDITIONS VALUE UNIT
D (SOIC) Package
Human Body Model (HBM) ESD stress voltage All terminals(1) ±6000 V
CAN bus terminals (CANH, CANL) to GND(2) ±16000
Charged Device Model (CDM) ESD stress voltage All terminals(3) ±1500 V
Machine Model (MM) All terminals(4) ±200
DRB (VSON) Package
Human Body Model (HBM) ESD stress voltage All terminals(1) ±6000 V
CAN bus terminals (CANH, CANL) to GND(2) ±16000
Charged Device Model (CDM) ESD stress voltage All terminals(3) ±1500 V
Machine Model (MM) All terminals(4) ±200
Tested in accordance to JEDEC Standard 22, Test Method A114.
Test method based upon JEDEC Standard 22 Test Method A114, CAN bus is stressed with respect to GND.
Tested in accordance to JEDEC Standard 22, Test Method C101.
Tested in accordance to JEDEC Standard 22, Test Method A115.