SLLSES7C March   2016  – May 2017 TCAN1042H , TCAN1042HG , TCAN1042HGV , TCAN1042HV

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configurations and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Rating
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 9.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Requirements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Specifications

Absolute Maximum Ratings(1) (2)

MIN MAX UNIT
VCC 5-V bus supply voltage range –0.3 7 V
VIO I/O Level Shifting Voltage Range Devices with the "V" suffix –0.3 7 V
VBUS CAN Bus I/O voltage range
(CANH, CANL)
Devices without the "H" suffix –58 58 V
V(Diff) Max differential voltage between
CANH and CANL
Devices without the “H” suffix –58 58 V
VBUS CAN Bus I/O voltage range
(CANH, CANL)
Devices with the "H" suffix –70 70 V
V(Diff) Max differential voltage between
CANH and CANL
Devices with the “H” suffix –70 70 V
V(Logic_Input) Logic input terminal voltage range (TXD, STB) –0.3 7 and VI ≤ VIO + 0.3 V
V(Logic_Output) Logic output terminal voltage range (RXD) –0.3 7 and VI ≤ VIO + 0.3 V
IO(RXD) RXD (Receiver) output current –8 8 mA
TJ Virtual junction temperature range (see Thermal Information) –55 150 °C
TSTG Storage temperature range (see Thermal Information) –65 150 °C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to ground terminal.

ESD Ratings

TEST CONDITIONS VALUE UNIT
D (SOIC) Package
Human Body Model (HBM) ESD stress voltage All terminals(1) ±6000 V
CAN bus terminals (CANH, CANL) to GND(2) ±16000
Charged Device Model (CDM) ESD stress voltage All terminals(3) ±1500 V
Machine Model (MM) All terminals(4) ±200
System Level Electro-Static Discharge (ESD) CAN bus terminals (CANH, CANL) to GND IEC 61000-4-2: Unpowered Contact Discharge ±15000 V
IEC 61000-4-2: Powered on Contact Discharge ±8000
System Level Electrical fast transient (EFT) CAN bus terminals (CANH, CANL) to GND IEC 61000-4-4: Criteria A ±4000 V
DRB (VSON) Package
Human Body Model (HBM) ESD stress voltage All terminals(1) ±6000 V
CAN bus terminals (CANH, CANL) to GND(2) ±16000
Charged Device Model (CDM) ESD stress voltage All terminals(3) ±1500 V
Machine Model (MM) All terminals(4) ±200
System Level Electro-Static Discharge (ESD) CAN bus terminals (CANH, CANL) to GND IEC 61000-4-2: Unpowered Contact Discharge ±14000 V
IEC 61000-4-2: Powered on Contact Discharge ±8000
System Level Electrical fast transient (EFT) CAN bus terminals (CANH, CANL) to GND IEC 61000-4-4: Criteria A ±4000 V
Tested in accordance to JEDEC Standard 22, Test Method A114.
Test method based upon JEDEC Standard 22 Test Method A114, CAN bus is stressed with respect to GND.
Tested in accordance to JEDEC Standard 22, Test Method C101.
Tested in accordance to JEDEC Standard 22, Test Method A115.

Recommended Operating Conditions

MIN MAX UNIT
VCC 5-V Bus Supply Voltage Range 4.5 5.5 V
VIO I/O Level-Shifting Voltage Range 3 5.5
IOH(RXD) RXD terminal HIGH level output current –2 mA
IOL(RXD) RXD terminal LOW level output current 2

Thermal Information

THERMAL METRIC(1) TEST CONDITIONS TCAN1042 UNIT
D (SOIC) DRB (VSON)
8 Pins 8 Pins
RθJA Junction-to-air thermal resistance High-K thermal resistance(2) 105.8 40.2 °C/W
RθJB Junction-to-board thermal resistance(3) 46.8 49.7 °C/W
RθJC(TOP) Junction-to-case (top) thermal resistance(4) 48.3 15.7 °C/W
ΨJT Junction-to-top characterization parameter(5) 8.7 0.6 °C/W
ΨJB Junction-to-board characterization parameter(6) 46.2 15.9 °C/W
TTSD Thermal shutdown temperature 170 170 °C
TTSD_HYS Thermal shutdown hysteresis 5 5 °C
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-top characterization parameter, ΨJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ΨJB estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).

Power Rating

PARAMETER TEST CONDITIONS POWER DISSIPATION UNIT
PD Average power dissipation VCC = 5 V, VIO = 5 V (if applicable), TJ = 27°C, RL = 60 Ω, S at 0 V, Input to TXD at 250 kHz, CL_RXD = 15 pF. Typical CAN operating conditions at 500 kbps with 25% transmission (dominant) rate. 52 mW
VCC = 5.5 V, VIO = 5.5 V (if applicable), TJ = 150°C, RL = 50 Ω, S at 0 V, Input to TXD at 500 kHz, CL_RXD = 15 pF.  Typical high load CAN operating conditions at 1 Mbps with 50% transmission (dominant) rate and loaded network. 124 mW

Electrical Characteristics

Over recommended operating conditions with TA = –55°C to 125°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
SUPPLY CHARACTERISTICS
ICC 5-V supply current Normal mode (dominant) See Figure 5, TXD = 0 V, RL = 60 Ω,
CL = open, RCM = open, STB = 0 V, Typical Bus Load
40 70 mA
See Figure 5, TXD = 0 V, RL = 50 Ω,
CL = open, RCM = open, STB = 0 V,
High Bus Load
45 80
Normal mode (dominant – with bus fault) See Figure 5, TXD = 0 V, STB = 0 V, CANH = -12 V, RL = open, CL = open, RCM = open 180
Normal mode (recessive) See Figure 5, TXD = VCC or VIO, RL = 50 Ω, CL = open, RCM = open,
STB = 0 V
1.5 2.5
Standby mode Devices with the "V" suffix (I/O level-shifting), VCC not needed in Standby mode, See Figure 5,
TXD = VIO, RL = 50 Ω, CL = open,
RCM = open, STB = VIO
0.5 5 µA
Devices without the "V" suffix (5-V only), See Figure 5, TXD = VCC, RL = 50 Ω, CL = open, RCM = open, STB = VCC 22
IIO I/O supply current Normal mode RXD floating, TXD = STB = 0 or 5.5 V 90 300
Standby mode RXD floating, TXD = STB = VIO,
VCC = 0 or 5.5 V
12 17
UVVCC Rising undervoltage detection on VCC for protected mode All devices 4.2 4.4 V
Falling undervoltage detection on VCC for protected mode 3.8 4.0 4.25
VHYS(UVVCC) Hysteresis voltage on UVVCC 200 mV
UVVIO Undervoltage detection on VIO for protected mode Devices with the "V" suffix (I/O level-shifting) 1.3 2.75 V
VHYS(UVVIO) Hysteresis voltage on UVVIO for protected mode 80 mV
STB TERMINAL (MODE SELECT INPUT)
VIH High-level input voltage Devices with the "V" suffix (I/O level-shifting) 0.7 x VIO V
Devices without the "V" suffix (5-V only) 2
VIL Low-level input voltage Devices with the "V" suffix (I/O level-shifting) 0.3 x VIO
Devices without the "V" suffix (5-V only) 0.8
IIH High-level input leakage current STB = VCC = VIO = 5.5 V -2 2 µA
IIL Low-level input leakage current STB = 0V, VCC = VIO = 5.5 V –20 0 -2
Ilkg(OFF) Unpowered leakage current STB = 5.5 V, VCC = VIO = 0 V -1 0 1
TXD TERMINAL (CAN TRANSMIT DATA INPUT)
VIH High-level input voltage Devices with the "V" suffix (I/O level-shifting) 0.7 x VIO V
Devices without the "V" suffix (5-V only) 2
VIL Low-level input voltage Devices with the "V" suffix (I/O level-shifting) 0.3 x VIO
Devices without the "V" suffix (5-V only) 0.8
IIH High-level input leakage current TXD = VCC = VIO = 5.5 V –2.5 0 1 µA
IIL Low-level input leakage current TXD = 0 V, VCC = VIO = 5.5 V –100 -25 –7
Ilkg(OFF) Unpowered leakage current TXD = 5.5 V, VCC = VIO = 0 V –1 0 1
CI Input capacitance VIN = 0.4 x sin(2 x π x 2 x 106 x t) + 2.5 V 5 pF
RXD TERMINAL (CAN RECEIVE DATA OUTPUT)
VOH High-level output voltage Devices with the "V" suffix (I/O level-shifting), See Figure 6,
IO = –2 mA.
0.8 × VIO V
Devices without the "V" suffix
(5V only), See Figure 6,
IO = –2 mA.
4 4.6
VOL Low-level output voltage Devices with the "V" suffix (I/O level-shifting), See Figure 6, IO = +2 mA. 0.2 x VIO
Devices without the "V" suffix (5-V only), See Figure 6,
IO = +2 mA.
0.2 0.4
Ilkg(OFF) Unpowered leakage current RXD = 5.5 V, VCC = 0 V, VIO = 0 V –1 0 1 µA
DRIVER ELECTRICAL CHARACTERISTICS
VO(DOM) Bus output voltage (dominant) CANH See Figure 5 and Figure 14, TXD = 0 V, STB = 0 V, 50 Ω ≤ RL ≤ 65 Ω,
CL = open, RCM = open
2.75 4.5 V
CANL 0.5 2.25
VO(REC) Bus output voltage (recessive) CANH and CANL See Figure 5 and Figure 14, TXD = VCC or VIO, VIO = VCC, STB = 0 V ,
RL = open (no load), RCM = open
2 0.5 × VCC 3
VO(STB) Bus output voltage (Standby mode) CANH See Figure 5 and Figure 14, STB = VIO, RL = open (no load), RCM = open -0.1 0 0.1
CANL -0.1 0 0.1
CANH - CANL -0.2 0 0.2
VOD(DOM) Differential output voltage (dominant) CANH - CANL See Figure 5 and Figure 14, TXD = 0 V, STB = 0 V, 45 Ω ≤ RL < 50 Ω,
CL = open, RCM = open
1.4 3
See Figure 5 and Figure 14, TXD = 0 V, STB = 0 V, 50 Ω ≤ RL ≤ 65 Ω,
CL = open, RCM = open
1.5 3
See Figure 5 and Figure 14, TXD = 0 V, STB = 0 V, RL = 2240 Ω, CL = open, RCM = open 1.5 5
VOD(REC) Differential output voltage (recessive) CANH - CANL See Figure 5 and Figure 14, TXD = VCC, STB = 0 V, RL = 60 Ω, CL = open, RCM = open –120 12 mV
See Figure 5 and Figure 14, TXD = VCC, STB = 0 V, RL = open (no load), CL = open, RCM = open –50 50
VSYM Output symmetry (dominant or recessive)
( VO(CANH) + VO(CANL)) / VCC
See Figure 5 and Figure 17, STB at 0 V, Rterm = 60 Ω, Csplit = 4.7 nF, CL = open,
RCM = open, TXD = 250 kHz, 1 MHz
0.9 1.1 V/V
VSYM_DC DC Output symmetry (dominant or recessive)
(VCC – VO(CANH) – VO(CANL))
See Figure 5 and Figure 14, STB = 0 V,
RL = 60 Ω, CL = open, RCM = open
–0.4 0.4 V
IOS(SS_DOM) Short-circuit steady-state output current, dominant, Normal mode See Figure 14 and Figure 11, STB at 0 V, VCANH = -5 V to 40 V, CANL = open,
TXD = 0 V
–100 mA
See Figure 14 and Figure 11, STB at 0 V, VCANL = -5 V to 40 V, CANH = open,
TXD = 0 V
100
IOS(SS_REC) Short-circuit steady-state output current, recessive, Normal mode See Figure 14 and Figure 11, STB at 0 V, –27 V ≤ VBUS ≤ 32 V,
Where VBUS = CANH = CANL, TXD = VCC
–5 5 mA
RECEIVER ELECTRICAL CHARACTERISTICS
VCM Common mode range, Normal mode See Figure 6 and Table 1, STB = 0 V -30 +30 V
VIT+ Positive-going input threshold voltage, Normal mode See Figure 6, Table 6 and Table 1,
STB = 0 V, -20 V ≤ VCM ≤ +20 V
900 mV
VIT– Negative-going input threshold voltage, Normal mode 500
VIT+ Positive-going input threshold voltage, Normal mode See Figure 6, Table 6 and Table 1,
STB = 0 V, -30 V ≤ VCM ≤ +30 V
1000
VIT– Negative-going input threshold voltage, Normal mode 400
VHYS Hysteresis voltage (VIT+ - VIT–), Normal mode See Figure 6, Table 6 and Table 1,
STB = 0 V
120
VCM Common mode range, Standby mode Devices with the "V" suffix (I/O level-shifting), See Figure 6, Table 6 and Table 1, STB = VIO, 4.5 V ≤ VIO ≤ 5.5 V -12 12 V
Devices with the "V" suffix (I/O level-shifting), See Figure 6, Table 6 and Table 1, STB = VIO, 3.0 V ≤ VIO ≤ 4.5 V -2 +7
Devices without the "V" suffix (5V only), See Figure 6, Table 6 and Table 1, STB = VCC -12 12
VIT(STANDBY) Input threshold voltage, Standby mode STB = VCC or VIO 400 1150 mV
ILKG(IOFF) Power-off (unpowered) bus input leakage current CANH = CANL = 5 V, VCC = VIO = 0 V 4.8 µA
CI Input capacitance to ground (CANH or CANL) TXD = VCC, VIO = VCC 24 30 pF
CID Differential input capacitance (CANH to CANL) TXD = VCC, VIO = VCC 12 15
RID Differential input resistance TXD = VCC = VIO = 5 V, STB = 0 V,
-30 V ≤ VCM ≤ +30 V
30 80
RIN Input resistance (CANH or CANL) 15 40
RIN(M) Input resistance matching:
[1 – RIN(CANH) / RIN(CANL)] × 100%
VCANH = VCANL = 5 V –2% +2%
All typical values are at 25°C and supply voltages of VCC = 5 V and VIO = 5 V (if applicable), RL = 60 Ω.

Switching Characteristics

Over recommended operating conditions with TA = -55°C to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
DEVICE SWITCHING CHARACTERISTICS
tPROP(LOOP1) Total loop delay, driver input (TXD) to receiver output (RXD), recessive to dominant See Figure 8, STB = 0 V,
RL = 60 Ω,
CL = 100 pF, CL(RXD) = 15 pF
100 160 ns
tPROP(LOOP2) Total loop delay, driver input (TXD) to receiver output (RXD), dominant to recessive 110 175
tMODE Mode change time, from Normal to Standby or from Standby to Normal See Figure 7 9 45 µs
tWK_FILTER Filter time for valid wake up pattern 0.5 1.85 µs
DRIVER SWITCHING CHARACTERISTICS
tpHR Propagation delay time, high TXD to driver recessive (dominant to recessive) See Figure 5, STB = 0 V,
RL = 60 Ω,
CL = 100 pF, RCM = open
75 ns
tpLD Propagation delay time, low TXD to driver dominant (recessive to dominant) 55
tsk(p) Pulse skew (|tpHR - tpLD|) 20
tR Differential output signal rise time 45
tF Differential output signal fall time 45
tTXD_DTO Dominant timeout See Figure 10, STB = 0 V,
RL = 60 Ω, CL = open
1.2 3.8 ms
RECEIVER SWITCHING CHARACTERISTICS
tpRH Propagation delay time, bus recessive input to high output (Dominant to Recessive) See Figure 6, STB = 0 V,
CL(RXD) = 15 pF
65 ns
tpDL Propagation delay time, bus dominant input to low output (Recessive to Dominant) 50 ns
tR RXD Output signal rise time 10 ns
tF RXD Output signal fall time 10 ns
FD Timing Parameters
tBIT(BUS) Bit time on CAN bus output pins with tBIT(TXD) = 500 ns, all devices See Figure 9 , STB = 0 V,
RL = 60 Ω, CL = 100 pF,
CL(RXD) = 15 pF,
ΔtREC = tBIT(RXD) - tBIT(BUS)
435 530 ns
Bit time on CAN bus output pins with tBIT(TXD) = 200 ns, G device variants only 155 210
tBIT(RXD) Bit time on RXD output pins with tBIT(TXD) = 500 ns, all devices 400 550
Bit time on RXD output pins with tBIT(TXD) = 200 ns, G device variants only 120 220
ΔtREC Receiver timing symmetry with tBIT(TXD) = 500 ns, all devices -65 40
Receiver timing symmetry with tBIT(TXD) = 200 ns, G device variants only -45 15

Typical Characteristics

TCAN1042 TCAN1042G TCAN1042GV TCAN1042H TCAN1042HG TCAN1042HGV TCAN1042HV TCAN1042V D001_SLLSES7.gif
VCC = 5 V VIO = 3.3 V RL = 60 Ω
CL = Open RCM = Open STB = 0 V
Figure 1. VOD(D) over Temperature
TCAN1042 TCAN1042G TCAN1042GV TCAN1042H TCAN1042HG TCAN1042HGV TCAN1042HV TCAN1042V D003_SLLSES7.gif
VCC = 5 V VIO = 3.3 V RL = 60 Ω
CL = Open RCM = Open STB = 0 V
Figure 3. ICC Recessive over Temperature
TCAN1042 TCAN1042G TCAN1042GV TCAN1042H TCAN1042HG TCAN1042HGV TCAN1042HV TCAN1042V D002_SLLSES7.gif
VIO = 5 V STB = 0 V RL = 60 Ω
CL = Open RCM = Open Temp = 25°C
Figure 2. VOD(D) over VCC
TCAN1042 TCAN1042G TCAN1042GV TCAN1042H TCAN1042HG TCAN1042HGV TCAN1042HV TCAN1042V D004_SLLSES7.gif
VCC = 5 V VIO = 3.3 V RL = 60 Ω
CL = 100 pF CL_RXD = 15 pF STB = 0 V
Figure 4. Total Loop Delay over Temperature