SLLSFJ3C February   2021  – December 2021 TCAN1044A-Q1 , TCAN1044AV-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Characteristics
    6. 7.6  Supply Characteristics
    7. 7.7  Dissipation Ratings
    8. 7.8  Electrical Characteristics
    9. 7.9  Switching Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Pin Description
        1. 9.3.1.1 TXD
        2. 9.3.1.2 GND
        3. 9.3.1.3 VCC
        4. 9.3.1.4 RXD
        5. 9.3.1.5 VIO
        6. 9.3.1.6 CANH and CANL
        7. 9.3.1.7 STB (Standby)
      2. 9.3.2 CAN Bus States
      3. 9.3.3 TXD Dominant Timeout (DTO)
      4. 9.3.4 CAN Bus short-circuit current limiting
      5. 9.3.5 Thermal Shutdown (TSD)
      6. 9.3.6 Undervoltage Lockout
      7. 9.3.7 Unpowered Device
      8. 9.3.8 Floating pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 CAN Termination
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Bus Loading, Length and Number of Nodes
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Thermal Characteristics

THERMAL METRIC(1) TCAN1044Ax-Q1 UNIT
D (SOIC) DDF (SOT) DRB (VSON)
RθJA Junction-to-ambient thermal resistance 127.5 122 55.2 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 67.6 63 62.4 ℃/W
RθJB Junction-to-board thermal resistance 70.9 42.4 27.5 ℃/W
ΨJT Junction-to-top characterization parameter 19.3 2.4 2.3 ℃/W
ΨJB Junction-to-board characterization parameter 70.2 42.2 27.4 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance -- -- 11.5 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.