SLLSET0C October   2016  – May 2017 TCAN1051-Q1 , TCAN1051G-Q1 , TCAN1051GV-Q1 , TCAN1051H-Q1 , TCAN1051HG-Q1 , TCAN1051HGV-Q1 , TCAN1051HV-Q1 , TCAN1051V-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Rating
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 9.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Silent Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Requirements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC Q100: Qualified for Automotive Applications
    • Device Temperature Grade 1: -40°C to 125°C Ambient Operating Temperature
    • Device HBM Classification Level: ±16 kV
    • Device CDM Classification Level ±1500 V
  • Meets the ISO 11898-2:2016 and
    ISO 11898-5:2007 Physical Layer Standards
  • 'Turbo' CAN:
    • All Devices Support Classic CAN and 2 Mbps CAN FD (Flexible Data Rate) and "G" Options Support 5 Mbps
    • Short and Symmetrical Propagation Delay Times and Fast Loop Times for Enhanced Timing Margin
    • Higher Data Rates in Loaded CAN Networks
  • I/O Voltage Range Supports 3.3 V and 5 V MCUs
  • Ideal Passive Behavior When Unpowered
    • Bus and Logic Terminals are High Impedance (no load)
    • Power Up/Down With Glitch Free Operation On Bus and RXD Output
  • Protection Features
    • IEC ESD Protection up to ±15 kV
    • Bus Fault Protection: ±58 V (non-H variants) and ±70 V (H variants)
    • Undervoltage Protection on VCC and VIO (V variants only) Supply Terminals
    • Driver Dominant Time Out (TXD DTO) - Data rates down to 10 kbps
    • Thermal Shutdown Protection (TSD)
  • Receiver Common Mode Input Voltage: ±30 V
  • Typical Loop Delay: 110 ns
  • Junction Temperatures from –55°C to 150°C
  • Available in SOIC(8) Package and Leadless VSON(8) Package (3.0 mm x 3.0 mm) with Improved Automated Optical Inspection (AOI) Capability

2 Applications

  • Automotive and Transportation
  • All devices support highly loaded CAN networks
  • Heavy Machinery ISOBUS Applications –
    ISO 11783

3 Description

This CAN transceiver family meets the ISO11898-2 (2016) High Speed CAN (Controller Area Network) physical layer standard. All devices are designed for use in CAN FD networks up to 2 Mbps (megabits per second). Devices with part numbers that include the "G" suffix are designed for data rates up to 5 Mbps, and versions with the "V" have a secondary power supply input for I/O level shifting the input pin thresholds and RXD output level. This family of devices comes with silent mode which is also commonly referred to as listen-only mode. Additionally, all devices include many protection features to enhance device and network robustness.

Device Information

ORDER NUMBER PACKAGE BODY SIZE
TCAN1051x-Q1 SOIC (8) 4.90 mm × 3.91 mm
VSON (8) 3.00 mm x 3.00 mm

Functional Block Diagram

TCAN1051-Q1 TCAN1051V-Q1 TCAN1051H-Q1 TCAN1051HV-Q1 TCAN1051G-Q1 TCAN1051GV-Q1 TCAN1051HG-Q1 TCAN1051HGV-Q1 fbd_TCAN1051_sllses8.gif
A. Terminal 5 function is device dependent; NC on devices without the "V" suffix, and VIO for I/O level shifting for devices with the "V" suffix.
B. RXD logic output is driven to VCC on devices without the "V" suffix, and VIO for devices with the "V" suffix.

4 Revision History

Changes from B Revision (May 2016) to C Revision

  • Added items to the Automotive Applications FeaureGo
  • Deleted Feature "Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer Update"Go
  • Changed Feature From: "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" To: "Meets the ISO 11898-2:2016 and ISO 11898-5:2007 Physical Layer Standards"Go
  • Changed Feature From: "All devices support 2 Mbps CAN FD.." To: "All Devices Support Classic CAN and 2 Mbps CAN FD.."Go
  • Added Feature "Available in SOIC(8) package and leadless VSON(8) package..."Go
  • Changed Applications From: Heavy Machinery ISO11783 To: Heavy Machinery ISOBUS Applications – ISO 11783Go
  • Changed the Functional Block Diagram, removed the Dominant time-out boxGo
  • Changed "D Package for (HV) and (HGV)" To: "DRB Package for (HV) and (HGV)" Go
  • Added Storage temperature range to the Absolute Maximum Ratings tableGo
  • Changed the ESD Ratings table to show the D(SOIC) and DRB (VSON) values Go
  • Changed Human Body Model (HBM) From: ±10000 To: ±16000 in the ESD tableGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD tableGo
  • Added the Power Rating table Go
  • Changed VSYM in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed VSYM_DC in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" from the Test Condition of CID in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the RECEIVER ELECTRICAL CHARACTERISTICS table tableGo
  • Changed the Functional Block Diagram, removed the Dominant time-out boxGo
  • Changed Table 3, BUS OUTPUT columGo

Changes from A Revision (April 2016) to B Revision

  • Added Feature "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" Go
  • Changed Feature From: Meets the Requirements of ISO11898-2 (2016) To: Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer Update Go
  • Changed the Applications listGo
  • Added the VSON (8) pin package to the Device Information tableGo
  • Added the VSON (8) pin package to the Pin Configurations and FunctionsGo
  • Added V(Diff) to the Absolute Maximum Ratings table Go
  • Added the DRB package to the Thermal Information table Go

Changes from * Revision (March 2016) to A Revision