SLLSFF2A February   2022  – June 2022 TCAN1462-Q1 , TCAN1462V-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Device Comparison Table
  7. 7 Pin Configurations and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  ESD Ratings, IEC Transients
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Thermal Characteristics
    6. 8.6  Supply Characteristics
    7. 8.7  Dissipation Ratings
    8. 8.8  Electrical Characteristics
    9. 8.9  Switching Characteristics
    10. 8.10 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
      1. 10.1.1 Signal Improvement
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Pin Description
        1. 10.3.1.1 TXD
        2. 10.3.1.2 GND
        3. 10.3.1.3 VCC
        4. 10.3.1.4 RXD
        5. 10.3.1.5 VIO (only for TCAN1462V-Q1)
        6. 10.3.1.6 CANH and CANL
        7. 10.3.1.7 STB (Standby)
      2. 10.3.2 CAN Bus States
      3. 10.3.3 TXD Dominant Timeout (DTO)
      4. 10.3.4 CAN Bus Short-circuit Current Limiting
      5. 10.3.5 Thermal Shutdown (TSD)
      6. 10.3.6 Undervoltage Lockout
      7. 10.3.7 Unpowered Device
      8. 10.3.8 Floating pins
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating Modes
      2. 10.4.2 Normal Mode
      3. 10.4.3 Standby Mode
        1. 10.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 10.4.4 Driver and Receiver Function
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 Bus Loading, Length and Number of Nodes
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
    4. 11.4 Power Supply Recommendations
    5. 11.5 Layout
      1. 11.5.1 Layout Guidelines
      2. 11.5.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.1 Signal Improvement

Signal improvement is an additional capability added to CAN FD transceiver that enhances the maximum data rate achievable in complex star topologies by minimizing signal ringing. Signal ringing is the result of reflections caused by impedance mismatch at various points in a CAN network due to the nodes that act as stubs.

An example of a complex network is shown in Figure 10-1.

GUID-20211111-SS0I-2VZR-3BLF-SMHCS8MWBGTP-low.gif Figure 10-1 CAN Network: Star topology

Recessive-to-dominant signal edge is usually clean as it is strongly driven by the transmitter. Transmitter output impedance of CAN transceiver is ~50 Ω and matches to the network characteristic impedance. For a regular CAN FD transceiver, dominant-to-recessive edge is when the driver output impedance goes to ~60 kΩ and signal reflected back experiences impedance mismatch which causes ringing. TCAN1462-Q1 resolves this issue by TX-based Signal improvement capability (SIC). The device continues to drive the bus recessive until tSIC_TX_base so that reflections die down and recessive bit is clean at sampling point. In the active recessive phase, transmitter output impedance is low (~100 Ω). After this phase is over and device goes to passive recessive phase, driver output impedance goes to high-Z. This phenomenon is explained with Figure 10-2.

For more information on TI's signal improvement technology, and how it compares with similar devices in market, please refer to the white paper How Signal Improvement Capability Unlocks the Real Potential of CAN-FD Transceivers.

GUID-20211111-SS0I-HDM1-CCW1-BLMRRX2XKGGT-low.gif Figure 10-2 TX based SIC