SLLSG09
August 2026
TCAN2957-Q1
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
IEC ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Supply Characteristics
6.7
Electrical Characteristics
6.8
Timing Requirements
6.9
Switching Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
VCC1 Regulator
8.3.2
VCC2 Regulator
8.3.3
VEXCC Regulator
8.3.3.1
VEXCC in Stand-alone Configuration
8.3.3.2
VEXCC in Load-Sharing Conguration with VCC1
8.3.3.2.1
VEXCC: Unused Pins Configuration
8.3.4
CAN FD Transceiver
8.3.4.1
Driver and Receiver Function
8.3.4.2
CAN Bus Biasing
8.3.5
LIN Transceiver
8.3.5.1
LIN Transmitter Characteristics
8.3.5.2
LIN Receiver Characteristics
8.3.5.3
LIN Termination
8.3.6
High-Side Switches
8.3.7
WAKE and Voltage Monitoring Input
8.3.7.1
WAKE Pins Alternate Configurations
8.3.7.1.1
VBAT monitoring
8.3.7.1.2
Direct Drive
8.3.7.1.3
Using Wake Pins For Hardware ID Function
8.3.8
nRST Pin
8.3.9
LIMP Output
8.3.10
Interrupt Function
8.3.11
SW Pin
8.3.12
GFO Pin
8.3.13
Wake Features
8.3.13.1
CAN Bus Wake via CRXD Request (BWRR) in Sleep Mode
8.3.13.2
LIN Bus Wake
8.3.13.3
Local Wake Up (LWU) via WAKEx Input Terminal
8.3.13.3.1
Static Wake
8.3.13.3.2
Cyclic Sensing Wake
8.3.13.4
Cyclic Wake
8.3.13.5
Direct Drive in Sleep Mode
8.3.14
Long Duration Timer
8.3.15
Safety Features
8.3.15.1
Watchdog
8.3.15.1.1
Watchdog Error Counter and Action
8.3.15.1.2
Watchdog SPI Programming
8.3.15.1.2.1
Watchdog Configuration Registers Lock and Unlock
8.3.15.1.3
Watchdog Timing
8.3.15.1.4
Question and Answer Watchdog
8.3.15.1.4.1
WD Question and Answer Basic Information
8.3.15.1.4.2
Question and Answer Register and Settings
8.3.15.1.4.3
WD Question and Answer Value Generation
8.3.15.1.4.3.1
Answer Comparison
8.3.15.1.4.3.2
Sequence of the 2-bit Watchdog Answer Counter
8.3.15.1.4.4
Question and Answer WD Example
8.3.15.1.4.4.1
Example Configuration for Desired Behavior
8.3.15.1.4.4.2
Example of Performing a Question and Answer Sequence
8.3.15.2
Under/Over Voltage Lockout and Unpowered Device
8.3.15.2.1
Under-voltage
8.3.15.2.1.1
VSUP and VHSS Under-voltage
8.3.15.2.1.2
VCC1 Under-voltage
8.3.15.2.1.3
VCC2 and VEXCC Under-voltage
8.3.15.2.1.4
VCAN Under-voltage
8.3.15.2.2
VCC1, VCC2 and VEXCC Over-voltage
8.3.15.2.3
VCC1, VCC2 and VEXCC Short Circuit
8.3.15.3
Analog Built-in Self Test (ABIST)
8.3.15.4
Clock Monitoring
8.3.15.5
Bandgap Cross-Monitoring
8.3.15.6
Device Reset
8.3.15.7
Floating Terminals
8.3.15.8
LIN Bus Stuck Dominant System Fault: False Wake Up Lockout
8.3.15.9
Thermal Shutdown
8.3.15.10
Bus Fault Detection and Communication
8.3.16
SPI Communication
8.3.16.1
Cyclic Redundancy Check
8.3.16.2
Chip Select Not (nCS):
8.3.16.3
SPI Clock Input (SCK):
8.3.16.4
SPI Data Input (SDI):
8.3.16.5
SPI Data Output (SDO):
8.4
Device Functional Modes
8.4.1
Init Mode
8.4.2
Normal Mode
8.4.3
Standby Mode
8.4.4
Restart Mode
8.4.5
Fail-safe Mode
8.4.6
Sleep Mode
9
Device Registers
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.1.1
Normal Mode Application Note
10.2.1.2
Standby Mode Application Note
10.2.1.3
LTXD Dominant State Timeout Application Note
10.2.2
Detailed Design Procedures
10.2.2.1
CAN Detailed Design Procedure
10.2.2.2
LIN Detailed Design Procedures
10.2.3
Device Brownout information
10.3
Power Supply Recommendations
10.4
Layout
10.4.1
Layout Guidelines
10.4.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
CAN Transceiver Physical Layer Standards:
11.1.2
LIN Transceiver Physical Layer Standards
11.1.3
EMC Requirements:
11.1.4
Conformance Test Requirements:
11.1.5
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
13.1
Tape and Reel Information
13.2
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sllsg09_oa
Data Sheet
TCAN29xx-Q1 Automotive, Functional Safety-Compliant CAN FD and LIN System Basis Chip (SBC) Family With Integrated LDOs and Enhanced Diagnostics