SLDS145C October   2001  – December 2014 TFP410

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 T.M.D.S. Pixel Data and Control Signal Encoding
      2. 7.3.2 Universal Graphics Controller Interface Voltage Signal Levels
      3. 7.3.3 Universal Graphics Controller Interface Clock Inputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Universal Graphics Controller Interface Modes
      2. 7.4.2 Data De-skew Feature
      3. 7.4.3 Hot Plug/Unplug (Auto Connect/Disconnect Detection)
      4. 7.4.4 Device Configuration and I2C RESET Description
      5. 7.4.5 DE Generator
    5. 7.5 Programming
      1. 7.5.1 I2C interface
    6. 7.6 Register Maps
      1. 7.6.1  VEN_ID Register (Sub-Address = 01−00 ) [reset = 0x014C]
      2. 7.6.2  DEV_ID Register (Sub-Address = 03-02) [reset = 0x0410]
      3. 7.6.3  REV_ID Register (Sub-Address = 04) [reset = 0x00]
      4. 7.6.4  Reserved Register (Sub-Address = 07-05) [reset = 0x641400]
      5. 7.6.5  CTL_1_MODE (Sub-Address = 08) [reset = 0xFE]
      6. 7.6.6  CTL_2_MODE Register (Sub-Address = 09) [reset = 0x00]
      7. 7.6.7  CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]
      8. 7.6.8  CFG Register (Sub-Address = 0B)
      9. 7.6.9  RESERVED Register (Sub-Address = 0E-0C) [reset = 0x97D0A9]
      10. 7.6.10 DE_DLY Register (Sub-Address = 32) [reset = 0x00]
      11. 7.6.11 DE_CTL Register (Sub-Address = 33) [reset = 0x00]
      12. 7.6.12 DE_TOP Register (Sub-Address = 34) [reset = 0x00]
      13. 7.6.13 DE_CNT Register (Sub-Address = 37-36) [reset = 0x0000]
      14. 7.6.14 DE_LIN Register (Sub-Address = 39-38) [reset = 0x0000]
      15. 7.6.15 H_RES Register (Sub-Address = 3B−3A)
      16. 7.6.16 V_RES Register (Sub-Address = 3D−3C)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Data and Control Signals
        2. 8.2.2.2 Configuration Options
        3. 8.2.2.3 Power Supplies Decoupling
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 DVDD
    2. 9.2 TVDD
    3. 9.3 PVDD
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layer Stack
      2. 10.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
      3. 10.1.3 DVI Connector
    2. 10.2 Layout Example
    3. 10.3 TI PowerPAD 64-Pin HTQFP Package
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.