SLOS423H September   2003  – December 2015 THS3091 , THS3095


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics THS3091
    6. 6.6  Electrical Characteristics THS3095
    7. 6.7  Dissipation Ratings Table
    8. 6.8  Typical Characteristics
    9. 6.9  Typical Characteristics (±15 V)
    10. 6.10 Typical Characteristics (±5 V)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Saving Power With Power-Down Functionality and Setting Threshold Levels With the Reference Pin
      2. 7.2.2 Power-Down Reference Pin Operation
    3. 7.3 Device Functional Modes
      1. 7.3.1 Wideband, Noninverting Operation
      2. 7.3.2 Wideband, Inverting Operation
      3. 7.3.3 Single-Supply Operation
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video Distribution
      2. 8.1.2 Driving Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PowerPAD Design Considerations
      1. 10.3.1 PowerPAD Layout Considerations
      2. 10.3.2 Power Dissipation and Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. Evaluation Fixtures, Spice Models, and Application Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support Evaluation Fixtures, Spice Models, and Application Support

Texas Instruments is committed to providing its customers with the highest quality of applications support. To support this goal, an evaluation board has been developed for the THS309x operational amplifier. The board is easy to use, allowing for straightforward evaluation of the device. The evaluation board can be ordered through the Texas Instruments Web site,, or through your local Texas Instruments sales representative.

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. This is particularly true for video and RF-amplifier circuits where parasitic capacitance and inductance can have a major effect on circuit performance. A SPICE model for the THS309x is available through the Texas Instruments Web site ( The Product Information Center (PIC) is also available for design assistance and detailed product information. These models do a good job of predicting small-signal ac and transient performance under a wide variety of operating conditions. They are not intended to model the distortion characteristics of the amplifier, nor do they attempt to distinguish between the package types in their small-signal ac performance. Detailed information about what is and is not modeled is contained in the model file itself.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

  • PowerPAD™ Made Easy, application brief (SLMA004)
  • PowerPAD™ Thermally Enhanced Package, technical brief (SLMA002)
  • Voltage Feedback vs Current Feedback Amplifiers, (SLVA051)
  • Current Feedback Analysis and Compensation (SLOA021)
  • Current Feedback Amplifiers: Review, Stability, and Application (SBOA081)
  • Effect of Parasitic Capacitance in Op Amp Circuits (SLOA013)
  • Expanding the Usability of Current-Feedback Amplifiers, 3Q 2003 Analog Applications Journal.

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

THS3091 Click here Click here Click here Click here Click here
THS3095 Click here Click here Click here Click here Click here

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution


These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.