SLOS423H September   2003  – December 2015 THS3091 , THS3095

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics THS3091
    6. 6.6  Electrical Characteristics THS3095
    7. 6.7  Dissipation Ratings Table
    8. 6.8  Typical Characteristics
    9. 6.9  Typical Characteristics (±15 V)
    10. 6.10 Typical Characteristics (±5 V)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Saving Power With Power-Down Functionality and Setting Threshold Levels With the Reference Pin
      2. 7.2.2 Power-Down Reference Pin Operation
    3. 7.3 Device Functional Modes
      1. 7.3.1 Wideband, Noninverting Operation
      2. 7.3.2 Wideband, Inverting Operation
      3. 7.3.3 Single-Supply Operation
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video Distribution
      2. 8.1.2 Driving Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PowerPAD Design Considerations
      1. 10.3.1 PowerPAD Layout Considerations
      2. 10.3.2 Power Dissipation and Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Fixtures, Spice Models, and Application Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The THS3091 can operate off a single supply or with dual supplies as long as the input CM voltage range (CMIR) has the required headroom to either supply rail. Operating from a single supply can have numerous advantages. With the negative supply at ground, the DC errors due to the –PSRR term can be minimized. Supplies should be decoupled with low inductance, often ceramic, capacitors to ground less than 0.5 inches from the device pins. The use of ground plane is recommended, and as in most high speed devices, it is advisable to remove ground plane close to device sensitive pins such as the inputs. An optional supply decoupling capacitor across the two power supplies (for split supply operation) improves second harmonic distortion performance.