SLOS423H September   2003  – December 2015 THS3091 , THS3095

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics THS3091
    6. 6.6  Electrical Characteristics THS3095
    7. 6.7  Dissipation Ratings Table
    8. 6.8  Typical Characteristics
    9. 6.9  Typical Characteristics (±15 V)
    10. 6.10 Typical Characteristics (±5 V)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Saving Power With Power-Down Functionality and Setting Threshold Levels With the Reference Pin
      2. 7.2.2 Power-Down Reference Pin Operation
    3. 7.3 Device Functional Modes
      1. 7.3.1 Wideband, Noninverting Operation
      2. 7.3.2 Wideband, Inverting Operation
      3. 7.3.3 Single-Supply Operation
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video Distribution
      2. 8.1.2 Driving Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PowerPAD Design Considerations
      1. 10.3.1 PowerPAD Layout Considerations
      2. 10.3.2 Power Dissipation and Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Fixtures, Spice Models, and Application Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (February, 2007) to H Revision

  • Added Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from F Revision (February, 2007) to G Revision

  • Changed common-mode rejection ratio specifications from 78 dB (typ) to 69 dB (typ); from 68 dB at +25°C to 62 dB; from 65 dB at (0°C to +70°C) and (–40°C to +85°C) to 59 dB.Go
  • Corrected load resistor value for output current specification (sourcing and sinking) from RL = 40 Ω to RL = 10 ΩGo
  • Changed output current (sourcing) specifications from 200 mA (typ) to 180 mA (typ); from 160 mA at +25°C to 140 mA; from 140 mA at (0°C to +70°C) and (–40°C to +85°C) to 120 mAGo
  • Corrected output current (sinking) specifications from 180 mA (typ) to –160 mA (typ); from 150 mA at +25°C to –140 mA; from 125 mA at (0°C to +70°C) and (–40°C to +85°C) to –120 mAGo