SLOS423H September   2003  – December 2015 THS3091 , THS3095

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics THS3091
    6. 6.6  Electrical Characteristics THS3095
    7. 6.7  Dissipation Ratings Table
    8. 6.8  Typical Characteristics
    9. 6.9  Typical Characteristics (±15 V)
    10. 6.10 Typical Characteristics (±5 V)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Saving Power With Power-Down Functionality and Setting Threshold Levels With the Reference Pin
      2. 7.2.2 Power-Down Reference Pin Operation
    3. 7.3 Device Functional Modes
      1. 7.3.1 Wideband, Noninverting Operation
      2. 7.3.2 Wideband, Inverting Operation
      3. 7.3.3 Single-Supply Operation
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video Distribution
      2. 8.1.2 Driving Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PowerPAD Design Considerations
      1. 10.3.1 PowerPAD Layout Considerations
      2. 10.3.2 Power Dissipation and Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Fixtures, Spice Models, and Application Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

D, DDA Package (THS3091)
8-Pin SOIC With PowerPAD
Top View
THS3091 THS3095 po_01_los423.gif
D, DDA Package (THS3095)
8-Pin SOIC With PowerPAD
Top View
THS3091 THS3095 po_02_los423.gif

Pin Functions(1)

PIN I/O DESCRIPTION
NAME SOIC SOT-23
THS3091
NC 1 No connection
5
8
Vin– 2 4 I Inverting input
Vin+ 3 3 I Noninverting input
–Vs 4 2 POW Negative power supply
Vout 6 1 O Output of amplifier
+Vs 7 5 POW Positive power supply
THS3095
NC 5 No connection
PD 8 I Amplifier power down, LOW - Amplifier disabled, HIGH (default) - Amplifier enabled
REF 1 I Voltage reference input to set PD threshold level
Vin– 2 4 I Inverting input
Vin+ 3 3 I Noninverting input
Vout 6 1 O Output of amplifier
–Vs 4 2 POW Negative power supply
+Vs 7 5 POW Positive power supply
(1) NC – No internal connection