SBOS875C August   2017  – February 2023 THS3491

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Bare Die Information
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics: VS = ±15 V
    6. 8.6 Electrical Characteristics: VS = ±7.5 V
    7. 8.7 Typical Characteristics: ±15 V
    8. 8.8 Typical Characteristics: ±7.5 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Down (PD) Pin
      2. 9.3.2 Power-Down Reference (REF) Pin
      3. 9.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Wideband Noninverting Operation
      2. 9.4.2 Wideband, Inverting Operation
      3. 9.4.3 Single-Supply Operation
      4. 9.4.4 Maximum Recommended Output Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving Capacitive Loads
      2. 10.1.2 Video Distribution
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
          1. 10.4.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
          2. 10.4.1.1.2 Power Dissipation and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VoltageSupply voltage, (+VS) – (–VS)33V
Supply voltage turnon, turnoff maximum dV/dT (2)1V/µs
Input/output voltage range(–VS) – 0.5(+VS) + 0.5V
Differential input voltage±0.5
CurrentContinuous input current (3)±10mA
Continuous output current (3)±100
TemperatureJunction temperature, TJ(4)Maximum150°C
Continuous operation, long-term reliability125
Storage temperature, Tstg(5)–65150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Stay below this dV/dT supply turnon and turnoff edge rate to make sure that the edge-triggered ESD absorption device across the supply pins remains open. Exceeding this supply edge rate may transiently show a short circuit across the supplies.
(3) Long-term continuous current for electro-migration limits.
(4) Thermal shutdown at approximately 160°C junction temperature and recovery at approximately 145°C.
(5) See the MSL or reflow rating information provided with the material or see https://www.ti.com for the latest information.