4 Revision History
Changes from Revision C (November 2020) to Revision D (April 2021)
- Corrected the wrong pin diagram image that was tagged incorrectly
during system migrationGo
Changes from Revision B (April 2020) to Revision C (November 2020)
- Updated the numbering format for tables, figures, and
cross-references throughout the document Go
- Added VQFN (16) Package to the Device Information
tableGo
- Updated the RHF package in the Pin Configuration and
Functions sectionGo
- Added the RGT package in the Pin Configuration and Functions
sectionGo
Changes from Revision A (December 2019) to Revision B (April 2020)
- Added Wafer Sale Package and Body Size (NOM) to the Device
Information table Go
- Added the YS Die bondpad and functionsGo
- Updated Table 1 BIAS-1 and BIAS-2 Logic TableGo
- Added Wafer and Die Information sectionGo
Changes from Revision * (August 2019) to Revision A (December 2019)
- Changed device status from advance information to production data Go