SBOS974D August   2019  – April 2021 THS6222

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 12 V
    6. 6.6 Electrical Characteristics: VS = 32 V
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics: VS = 12 V
    9. 6.9 Typical Characteristics: VS = 32 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Common-Mode Buffer
      2. 7.3.2 Thermal Protection and Package Power Dissipation
      3. 7.3.3 Output Voltage and Current Drive
      4. 7.3.4 Breakdown Supply Voltage
      5. 7.3.5 Surge Test Results
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Broadband PLC Line Driving
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 What to Do and What Not to Do
      1. 8.3.1 Do
      2. 8.3.2 Do Not
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Wafer and Die Information
    3. 10.3 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage Supply voltage, VS = (VS+) – (VS–)(2) 33 V
Bias control pin voltage, referenced to DGND 0 16.5 V
Common-mode voltage, VCM See Common-Mode Buffer V
All pins except VS+, VS–, VCM, and BIAS control (VS–) – 0.5 (VS+) + 0.5 V
Temperature Maximum junction, TJ (under any condition) 150 °C
Maximum junction, TJ (continuous operation, long-term reliability)(3) 125
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent device damage. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Refer to  Breakdown Supply Voltage for breakdown test results.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this temperature can result in reduced reliability or lifetime of the device. THS6222 has thermal protection that shuts down the device at approximately 175°C junction temperature and recovery at approximately 145°C.