SCPS268A September   2017  – February 2022 TIC10024-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Enable Selection
        3. 8.3.8.3 Thresholds Adjustment
        4. 8.3.8.4 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable / Disable And Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check And Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
  9. 9 Programming
    1. 9.1 SPI Communication Interface Buses
      1. 9.1.1 Chip Select ( CS)
      2. 9.1.2 System Clock (SCLK)
      3. 9.1.3 Slave In (SI)
      4. 9.1.4 Slave Out (SO)
    2. 9.2 SPI Sequence
      1. 9.2.1 Read Operation
      2. 9.2.2 Write Operation
      3. 9.2.3 Status Flag
    3. 9.3 Programming Guidelines
    4. 9.4 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Digital Switch Detection in Automotive Body Control Module
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Systems Examples
      1. 10.3.1 Using TIC10024-Q1 in a 12 V Automotive System
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-36D53819-A11D-4DFB-8C6E-2BB2738D38BF-low.gifFigure 5-1 DCP (TSSOP) Package, 38-Pin, Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 IN13 I/O Ground switch monitoring input with current source
2 IN14 I/O Ground switch monitoring input with current source
3 IN15 I/O Ground switch monitoring input with current source
4 IN16 I/O Ground switch monitoring input with current source
5 IN17 I/O Ground switch monitoring input with current source
6 IN18 I/O Ground switch monitoring input with current source
7 IN19 I/O Ground switch monitoring input with current source
8 IN20 I/O Ground switch monitoring input with current source
9 AGND P Ground for analog circuitry
10 IN21 I/O Ground switch monitoring input with current source
11 IN22 I/O Ground switch monitoring input with current source
12 IN23 I/O Ground switch monitoring input with current source
13 IN0 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
14 IN1 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
15 CS I Active-low input. Chip select from the commander for the SPI Interface.
16 SCLK I Serial clock output from the commander for the SPI Interface
17 SI I Serial data input for the SPI Interface.
18 SO O Serial data output for the SPI Interface
19 VDD P 3.3 V to 5 V logic supply for the SPI communication. The SPI I/Os are not fail-safe protected: VDD needs to be present during any SPI traffic to avoid excessive leakage currents and corrupted SPI I/O logic levels.
20 CAP_A I/O External capacitor connection for the analog LDO. Use capacitance value of 100nF.
21 RESET I Keep RESET low for normal operation and drive RESET high and release it to perform a hardware reset of the device. The RESET pin is connected to ground via a 1MΩ pull-down resistor. If not used, the RESET pin shall be grounded to avoid any accidental device reset due to coupled noise onto this pin.
22 CAP_Pre I/O External capacitor connection for the pre-regulator. Use capacitance value of 1 μF.
23 CAP_D I/O External capacitor connection for the digital LDO. Use capacitance value of 100 nF.
24 INT O Open drain output. Pulled low (internally) upon change of state on the input or occurrence of a special event.
25 IN2 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
26 IN3 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
27 IN4 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
28 DGND P Ground for digital circuitry
29 IN5 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
30 IN6 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
31 IN7 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
32 IN8 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
33 IN9 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
34 IN10 I/O Ground switch monitoring input with current source
35 IN11 I/O Ground switch monitoring input with current source
36 IN12 I/O Ground switch monitoring input with current source
37 VS P Power supply input pin.
38 VS P Power supply input pin.
--- EP P Exposed Pad. The exposed pad is not electrically connected to AGND or DGND. Connect EP to the board ground to achieve rated thermal and ESD performance.
(1) I = input, O = output, I/O = input and output, P = power.