SLOS080T September   1978  – December 2021 TL071 , TL071A , TL071B , TL071H , TL072 , TL072A , TL072B , TL072H , TL072M , TL074 , TL074A , TL074B , TL074H , TL074M

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings: TL07xH
    2. 6.2  Absolute Maximum Ratings: All Devices Except TL07xH
    3. 6.3  ESD Ratings: TL07xH
    4. 6.4  ESD Ratings: All Devices Except TL07xH
    5. 6.5  Recommended Operating Conditions: TL07xH
    6. 6.6  Recommended Operating Conditions: All Devices Except TL07xH
    7. 6.7  Thermal Information for Single Channel: TL071H
    8. 6.8  Thermal Information: TL071x
    9. 6.9  Thermal Information for Dual Channel: TL072H
    10. 6.10 Thermal Information: TL072x
    11. 6.11 Thermal Information: TL072x (cont.)
    12. 6.12 Thermal Information for Quad Channel: TL074H
    13. 6.13 Thermal Information: TL074x
    14. 6.14 Thermal Information: TL074x (cont).
    15. 6.15 Thermal Information: TL074x (cont).
    16. 6.16 Thermal Information
    17. 6.17 Electrical Characteristics: TL07xH
    18. 6.18 Electrical Characteristics: TL071C, TL072C, TL074C
    19. 6.19 Electrical Characteristics: TL071AC, TL072AC, TL074AC
    20. 6.20 Electrical Characteristics: TL071BC, TL072BC, TL074BC
    21. 6.21 Electrical Characteristics: TL071I, TL072I, TL074I
    22. 6.22 Electrical Characteristics: TL071M, TL072M
    23. 6.23 Electrical Characteristics: TL074M
    24. 6.24 Switching Characteristics: TL07xM
    25. 6.25 Switching Characteristics: TL07xC, TL07xAC, TL07xBC, TL07xI
    26. 6.26 Typical Characteristics: TL07xH
    27. 6.27 Typical Characteristics: All Devices Except TL07xH
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Total Harmonic Distortion
      2. 8.3.2 Slew Rate
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Unity Gain Buffer
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
    4. 9.4 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • PS|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision S (July 2021) to Revision T (December 2021)

  • Corrected DCK pinout diagram and table in Pin Configurations and Functions sectionGo

Changes from Revision R (June 2021) to Revision S (July 2021)

  • Deleted preview note from TL071H SOIC (8), SOT-23 (5) and SC70 (5) packages throughout the data sheetGo

Changes from Revision Q (June 2021) to Revision R (June 2021)

  • Deleted preview note from TL072H SOIC (8), SOT-23 (8) and TSSOP (8) packages throughout the data sheetGo
  • Added ESD information for TL072HGo
  • Added IQ spec for TL072HGo

Changes from Revision P (November 2020) to Revision Q (June 2021)

  • Deleted VSSOP (8) package from the Device Information sectionGo
  • Added DBV, DCK, and D packages to TL071H in Pin Configuration and Functions sectionGo
  • Deleted DGK package from TL072x in Pin Configuration and Functions sectionGo
  • Deleted tables with duplicate information from the Specifications sectionGo
  • Added  D, DCK, and DBV package thermal information in Thermal Information for Single Channel: TL071H sectionGo
  • Added D, DDF, and PW package thermal information in Thermal Information for Dual Channel: TL072H sectionGo
  • Added Iand IOS specification for single channel DCK and DBV packageGo
  • Added IQ spec for TL071HGo
  • Deleted Related Links section from the Device and Documentation Support sectionGo

Changes from Revision O (October 2020) to Revision P (November 2020)

  • Added SOIC and TSSOP package thermal information in Thermal Information for Quad Channel: TL074H section   Go
  • Added Typical Characteristics:TL07xH section in Specifications sectionGo

Changes from Revision N (July 2017) to Revision O (October 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Features of TL07xH added to the Features sectionGo
  • Added link to applications in the Applications sectionGo
  • Added TL07xH in the Description sectionGo
  • Added TL07xH device in the Device Information sectionGo
  • Added SOT-23 (14), VSSOP (8), SOT-23 (8), SC70 (5), and SOT-23 (5) packages to the Device Information sectionGo
  • Added TSSOP, VSSOP and DDF packages to TL072x in Pin Configuration and Functions sectionGo
  • Added DYY package to TL074x in Pin Configuration and Functions sectionGo
  • Removed Table of Graphs from the Typical Characteistics sectionGo
  • Deleted reference to obsolete documentation in Layout Guidelines sectionGo
  • Removed Related Documentation sectionGo

Changes from Revision M (February 2014) to Revision N (July 2017)

  • Updated data sheet text to latest documentation and translation standardsGo
  • Added TL072M and TL074M devices to data sheet Go
  • Rewrote text in Description section Go
  • Changed TL07x 8-pin PDIP package to 8-pin CDIP package in Device Information table Go
  • Deleted 20-pin LCCC package from Device Information table Go
  • Added 2017 copyright statement to front page schematicGo
  • Deleted TL071x FK (LCCC) pinout drawing and pinout table in Pin Configurations and Functions section Go
  • Updated pinout diagrams and pinout tables in Pin Configurations and Functions section Go
  • Deleted differential input voltage parameter from Absolute Maximum Ratings table Go
  • Deleted table notes from Absolute Maximum Ratings table Go
  • Added new table note to Absolute Maximum Ratings table Go
  • Changed minimum supply voltage value from –18 V to –0.3 V in Absolute Maximum Ratings tableGo
  • Changed maximum supply voltage from 18 V to 36 V in Absolute Maximum Ratings tableGo
  • Changed minimum input voltage value from –15 V to VCC– – 0.3 V in Absolute Maximum Ratings tableGo
  • Changed maximum input voltage from 15 V to VCC– + 36 V in Absolute Maximum Ratings tableGo
  • Added input clamp current parameter to Absolute Maximum Ratings table Go
  • Changed common-mode voltage maximum value from VCC+ – 4 V to VCC+ in the Recommended Operating Conditions tableGo
  • Changed devices in Recommended Operating Conditions table from TL07xA and TL07xB to TL07xAC and TL07xBC Go
  • Added TL07xI operating free-air temperature minimum value of –40°C to Recommended Operating Conditions table Go
  • Added U (CFP) package thermal values to Thermal Information: TL072x (cont.) tableGo
  • Added W (CFP) package thermal values to Thermal Information: TL074x (cont.) tableGo
  • Added Figure 6-59 to Typical Characteristics sectionGo
  • Added second Typical Application section application curves Go
  • Reformatted document references in Layout Guidelines section Go

Changes from Revision L (February 2014) to Revision M (February 2014)

  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout sectionGo

Changes from Revision K (January 2014) to Revision L (February 2014)

  • Moved Tstg to Handling Ratings table Go