SBAS980B June   2019  – June 2020 TLA2518

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      TLA2518 Block Diagram and Applications
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Multiplexer and ADC
      2. 7.3.2 Reference
      3. 7.3.3 ADC Transfer Function
      4. 7.3.4 ADC Offset Calibration
      5. 7.3.5 Programmable Averaging Filter
      6. 7.3.6 General-Purpose I/Os
      7. 7.3.7 Oscillator and Timing Control
      8. 7.3.8 Output Data Format
      9. 7.3.9 Device Programming
        1. 7.3.9.1 Enhanced-SPI Interface
        2. 7.3.9.2 Register Read/Write Operation
          1. 7.3.9.2.1 Register Write
          2. 7.3.9.2.2 Register Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Power-Up and Reset
      2. 7.4.2 Manual Mode
      3. 7.4.3 On-the-Fly Mode
      4. 7.4.4 Auto-Sequence Mode
    5. 7.5 TLA2518 Registers
      1. 7.5.1  SYSTEM_STATUS Register (Address = 0x0) [reset = 0x81]
        1. Table 9. SYSTEM_STATUS Register Field Descriptions
      2. 7.5.2  GENERAL_CFG Register (Address = 0x1) [reset = 0x0]
        1. Table 10. GENERAL_CFG Register Field Descriptions
      3. 7.5.3  DATA_CFG Register (Address = 0x2) [reset = 0x0]
        1. Table 11. DATA_CFG Register Field Descriptions
      4. 7.5.4  OSR_CFG Register (Address = 0x3) [reset = 0x0]
        1. Table 12. OSR_CFG Register Field Descriptions
      5. 7.5.5  OPMODE_CFG Register (Address = 0x4) [reset = 0x0]
        1. Table 13. OPMODE_CFG Register Field Descriptions
      6. 7.5.6  PIN_CFG Register (Address = 0x5) [reset = 0x0]
        1. Table 14. PIN_CFG Register Field Descriptions
      7. 7.5.7  GPIO_CFG Register (Address = 0x7) [reset = 0x0]
        1. Table 15. GPIO_CFG Register Field Descriptions
      8. 7.5.8  GPO_DRIVE_CFG Register (Address = 0x9) [reset = 0x0]
        1. Table 16. GPO_DRIVE_CFG Register Field Descriptions
      9. 7.5.9  GPO_VALUE Register (Address = 0xB) [reset = 0x0]
        1. Table 17. GPO_VALUE Register Field Descriptions
      10. 7.5.10 GPI_VALUE Register (Address = 0xD) [reset = 0x0]
        1. Table 18. GPI_VALUE Register Field Descriptions
      11. 7.5.11 SEQUENCE_CFG Register (Address = 0x10) [reset = 0x0]
        1. Table 19. SEQUENCE_CFG Register Field Descriptions
      12. 7.5.12 CHANNEL_SEL Register (Address = 0x11) [reset = 0x0]
        1. Table 20. CHANNEL_SEL Register Field Descriptions
      13. 7.5.13 AUTO_SEQ_CH_SEL Register (Address = 0x12) [reset = 0x0]
        1. Table 21. AUTO_SEQ_CH_SEL Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Mixed-Channel Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Digital Input
          2. 8.2.1.2.2 Digital Open-Drain Output
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Digital Push-Pull Output Configuration
  9. 9 Power Supply Recommendations
    1. 9.1 AVDD and DVDD Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

RTE Package
16-Pin WQFN
Top View

Pin Functions

PIN FUNCTION(1) DESCRIPTION
NAME NO.
AIN0/GPIO0 15 AI, DI, DO Channel 0; can be configured as either an analog input (default), digital input, or digital output.
AIN1/GPIO1 16 AI, DI, DO Channel 1; can be configured as either an analog input (default), digital input, or digital output.
AIN2/GPIO2 1 AI, DI, DO Channel 2; can be configured as either an analog input (default), digital input, or digital output.
AIN3/GPIO3 2 AI, DI, DO Channel 3; can be configured as either an analog input (default), digital input, or digital output.
AIN4/GPIO4 3 AI, DI, DO Channel 4; can be configured as either an analog input (default), digital input, or digital output.
AIN5/GPIO5 4 AI, DI, DO Channel 5; can be configured as either an analog input (default), digital input, or digital output.
AIN6/GPIO6 5 AI, DI, DO Channel 6; can be configured as either an analog input (default), digital input, or digital output.
AIN7/GPIO7 6 AI, DI, DO Channel 7; can be configured as either an analog input (default), digital input, or digital output.
AVDD 7 Supply Analog supply input, also used as the reference voltage to the ADC; connect a 1-µF decoupling capacitor to GND.
CS 11 DI Chip-select input pin; active low. The device takes control of the data bus when CS is low.
The device starts converting the active input channel on the rising edge of CS. SDO goes hi-Z when CS is high.
DECAP 8 Supply Connect a 1-µF decoupling capacitor to GND for the internal power supply.
DVDD 10 Supply Digital I/O supply voltage; connect a 1-µF decoupling capacitor to GND.
GND 9 Supply Ground for the power supply; all analog and digital signals are referred to this pin voltage.
SCLK 13 DI Serial clock for the SPI interface.
SDI 14 DI Serial data in for the device.
SDO 12 DO Serial data out for the device.
Thermal pad — Supply Exposed thermal pad; connect to GND.
(1) AI = analog input, DI = digital input, and DO = digital output.