SGLS007G February   2003  – August 2022 TLC2272-Q1 , TLC2272A-Q1 , TLC2274-Q1 , TLC2274A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VDD = 5 V (TLC2272-Q1 and TLC2272A-Q1)
    6. 6.6 Electrical Characteristics: VDD± = ±5 V (TLC2272-Q1 and TLC2272A-Q1)
    7. 6.7 Electrical Characteristics: VDD = 5 V (TLC2274-Q1 and TLC2274A-Q1)
    8. 6.8 Electrical Characteristics: VDD± = ±5 V (TLC2274-Q1 and TLC2274A-Q1)
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Macromodel Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Differential Amplifier Equations
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Related Documentation

For related documentation see the following:

  • G.R. Boyle, D.O. Pederson, B.M. Cohn, J.E. Solomon (Dec. 1974). Macromodeling of Integrated Circuit Operational Amplifiers. IEEE Journal of Solid-State Circuits, Volume 9, Issue 6, pages 353–364. Retrieved from https://ieeexplore.ieee.org/document/1050528