SLOS154C December 1995 – July 2025 TLC27L1 , TLC27L1A
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
Figure 4-1 D Package,8-Pin SOIC, or P Package, 8-Pin PDIP (Top View)| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| GND | 4 | Ground | Ground or negative (lowest) power supply |
| IN+ | 3 | Input | Noninverting input |
| IN– | 2 | Input | Inverting input |
| OFFSET N1 | 1 | Input | On legacy silicon: IN– offset adjustment pin (bias-select). On new silicon: NC, non internally connected pin |
| OFFSET N2 | 5 | Input | On legacy silicon: IN+ offset adjustment pin (bias-select). On new silicon: NC, non internally connected pin |
| OUT | 6 | Output | Output |
| VDD | 7, 8 | Power | Positive (highest) power supply |