SLOS191E February   1997  – July 2025 TLE2021AM , TLE2021B , TLE2021M-MIL , TLE2022AM-MIL , TLE2022BM , TLE2022M-MIL , TLE2024AM , TLE2024BM-MIL , TLE2024M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Device Comparison Tables
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Dissipation Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Electrical Characteristics TLE2021xM, VCC = 5 V
    5. 5.5  Operating Characteristics TLE2021M, VCC = 5 V
    6. 5.6  Electrical Characteristics TLE2021xM, VCC = ±15 V
    7. 5.7  Operating Characteristics TLE2021M, VCC = ±15 V
    8. 5.8  Electrical Characteristics TLE2022xM, VCC = 5 V
    9. 5.9  Operating Characteristics TLE2022M, VCC = 5 V
    10. 5.10 Electrical Characteristics TLE2022xM, VCC = ±15 V
    11. 5.11 Operating Characteristics TLE2022M, VCC = ±15 V
    12. 5.12 Electrical Characteristics TLE2024xM, VCC = 5 V
    13. 5.13 Operating Characteristics TLE2024M, VCC = 5 V
    14. 5.14 Electrical Characteristics TLE2024xM, VCC = ±15 V
    15. 5.15 Operating Characteristics TLE2024M, VCC = ±15 V
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Typical Values
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Voltage-Follower Applications
      2. 8.1.2 Input Offset Voltage Null
      3. 8.1.3 Macromodel Information
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • FK|20
  • JG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Device Comparison Tables

Table 3-1 TLE2021xM Available Options
TA PACKAGED DEVICES
VIOmax
AT 25°C		 CHIP
CARRIER
(FK))		 CERAMIC DIP
(JG)
–55°C to +125°C 100 V µV
500 µV		 TLE2021BMFK
TLE2021MFK		 TLE2021BMJG
TLE2021MJG
Table 3-2 TLE2022xM Available Options
TA PACKAGED DEVICES
VIOmax
AT 25°C		 CHIP
CARRIER
(FK))		 CERAMIC DIP
(JG)
–55°C to +125°C 150 µV
300 µV
500 µV		 —
TLE2022AMFK
TLE2022MFK		 TLE2022BMJG
TLE2022AMJG
TLE2022MJG
Table 3-3 TLE2024xM Available Options
TA PACKAGED DEVICES
VIOmax
AT 25°C		 CHIP
CARRIER
(FK))		 CERAMIC DIP
(J)
–55°C to +125°C 500 µV
750 µV
1000 µV		 TLE2024BMFK
TLE2024AMFK
TLE2024MFK		 TLE2024BMJ
TLE2024AMJ
TLE2024MJ