SLLSEZ8C December   2017  – May 2020 TLIN1022-Q1

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematics, Master Mode
      2.      Simplified Schematics, Slave Mode
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC
    4. 6.4 Thermal Information
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  LIN (Local Interconnect Network) Bus
        1. 8.3.1.1 LIN Transmitter Characteristics
        2. 8.3.1.2 LIN Receiver Characteristics
          1. 8.3.1.2.1 Termination
      2. 8.3.2  TXD (Transmit Input and Output)
      3. 8.3.3  RXD (Receive Output)
      4. 8.3.4  VSUP (Supply Voltage)
      5. 8.3.5  GND (Ground)
      6. 8.3.6  EN (Enable Input)
      7. 8.3.7  Protection Features
      8. 8.3.8  TXD Dominant Time Out (DTO)
      9. 8.3.9  Bus Stuck Dominant System Fault: False Wake Up Lockout
      10. 8.3.10 Thermal Shutdown
      11. 8.3.11 Under Voltage on VSUP
      12. 8.3.12 Unpowered Device and LIN Bus
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Sleep Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Wake Up Events
        1. 8.4.4.1 Wake Up Request (RXD)
        2. 8.4.4.2 Mode Transitions
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Normal Mode Application Note
        2. 9.2.2.2 Standby Mode Application Note
        3. 9.2.2.3 TXD Dominant State Timeout Application Note
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • AEC-Q100 Qualified for automotive applications
    • Temperature: –40°C to 125°C ambient
    • HBM certification level: ±8 kV
    • CDM certification level: ±1.5 kV
  • Compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4.2 (See SLLA491)
  • Conforms to SAEJ2602 recommended practice for LIN (See SLLA491)
  • Supports 12 V battery applications
  • LIN transmit data rate up to 20 kbps.
  • Wide operating ranges
    • 4 V to 36 V supply voltage
    • ±45 V LIN bus fault protection
  • Sleep mode: ultra-low current consumption allows wake-up event from:
    • LIN bus
    • Local wake up through EN
  • Power up and down glitch free operation
  • Protection features:
    • Under voltage protection on VSUP
    • TXD Dominant time out protection (DTO)
    • Thermal shutdown protection
    • Unpowered node or ground disconnection failsafe at system level.
  • Available in SOIC (14) package and leadless VSON (14) Package with improved automated optical inspection (AOI) capability