SLLSEX4B August   2019  – June 2022 TLIN1028-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, IEC Specification
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Charateristics
    8. 7.8 AC Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit: Diagrams and Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 LIN Pin
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2 TXD (Transmit Input)
      3. 9.3.3 RXD (Receive Output)
      4. 9.3.4 VSUP (Supply Voltage)
      5. 9.3.5 GND (Ground)
      6. 9.3.6 EN (Enable Input)
      7. 9.3.7 nRST (Reset Output)
      8. 9.3.8 VCC (Supply Output)
      9. 9.3.9 Protection Features
        1. 9.3.9.1 TXD Dominant Time Out (DTO)
        2. 9.3.9.2 Bus Stuck Dominant System Fault: False Wake Up Lockout
        3. 9.3.9.3 Thermal Shutdown
        4. 9.3.9.4 Under Voltage on VSUP
        5. 9.3.9.5 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
      5. 9.4.5 Mode Transitions
      6. 9.4.6 Voltage Regulator
        1. 9.4.6.1 VCC
        2. 9.4.6.2 Output Capacitance Selection
        3. 9.4.6.3 Low-Voltage Tracking
        4. 9.4.6.4 Power Supply Recommendation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Normal Mode Application Note
        2. 10.2.1.2 TXD Dominant State Timeout Application Note
        3. 10.2.1.3 Brownout
      2. 10.2.2 Detailed Design Procedures
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.3 Standby Mode

Standby mode is entered either by a wake-up event through LIN bus while the device is in sleep mode or by the EN pin from normal or standby init modes. From normal mode EN must be low for > tEN and TXD and nRST are high. RXD pin in standby mode is dependent upon how standby mode was entered. If entered from normal mode or power up, RXD is high. If entered from sleep mode, RXD is pulled low to indicate a wake event. When entering standby mode from normal or standby init modes, a wake event on the LIN bus causes the RXD pin to be pulled low.

During power up, if EN is low the device goes into standby mode, and if EN is high, the device goes into normal mode. EN has an internal pull-down resistor ensuring EN is pulled low if the pin is left floating in the system.