SBOS551C march 2011 – april 2023 TLV3011-Q1 , TLV3011B-Q1 , TLV3012-Q1 , TLV3012B-Q1

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

DCK|6
- MPDS114C
DBV|6
- MPDS026O

Thermal pad, mechanical data (Package|Pins)

DCK|6
- QFND228B

Orderable Information

7 Typical Characteristics - TLV3012-Q1 DCK Package Only

At T_A = 25°C, V_S = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted.

Figure 7-1 Quiescent Current vs Temperature

Figure 7-3 Input Bias Current vs Temperature

Figure 7-5 Output High vs Output Current

Figure 7-7 Propagation Delay (t_PHL) vs Capacitive Load

Figure 7-9 Propagation Delay (t_PHL) vs Input Overdrive

Figure 7-11 Propagation Delay (t_PHL) vs Temperature

Figure 7-13 Propagation Delay (t_PHL)

Figure 7-15 Propagation Delay (t_PHL)

Figure 7-17 Reference Voltage vs Output Load Current (Sinking)

Figure 7-19 Short-Circuit Current vs Supply Voltage

Figure 7-2 Quiescent Current vs Output Switching Frequency

Figure 7-4 Output Low vs Output Current

Figure 7-6 Propagation Delay (t_PLH) vs Capacitive Load

Figure 7-8 Propagation Delay (t_PLH) vs Input Overdrive

Figure 7-10 Propagation Delay (t_PLH) vs Temperature

Figure 7-12 Propagation Delay (t_PLH)

Figure 7-14 Propagation Delay (t_PLH)

Figure 7-16 Reference Voltage vs Output Load Current (Sourcing)

Figure 7-18 Reference Voltage vs Temperature

Figure 7-20 Reference Voltage Distribution