SBOS845B November   2016  – August 2017 TLV2316-Q1 , TLV316-Q1 , TLV4316-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV316-Q1
    5. 7.5 Thermal Information: TLV2316-Q1
    6. 7.6 Thermal Information: TLV4316-Q1
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics: Table of Graphs
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 EMI Susceptibility and Input Filtering
      7. 8.3.7 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 System Examples
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (December 2016) to B Revision

  • Corrected typo; changed part numbers from TLV314, TLV2314, and TLV4314 to TLV316-Q1, TLV2316-Q1, and TLV4316-Q1 in Features section Go
  • Changed values in the Thermal Information: TLV4316-Q1 table to align with JEDEC standards.Go

Changes from * Revision (November 2016) to A Revision

  • Changed the CDM ESD Classification Level from C6 to C5 in the Features sectionGo
  • Deleted the SC70 (5), SOIC (8), and SOIC (14) packages from the Device Information table Go
  • Deleted the DCK (SC70) package from the TLV316-Q1 pinout diagram in the Pin Configurations and Functions section Go
  • Deleted the DCK (SC70) pinout information from the Pin Functions: TLV316-Q1 table in the Pin Configurations and Functions section Go
  • Deleted D (SOIC) package from the TLV2316-Q1 pinout diagram in the Pin Configurations and Functions section Go
  • Deleted the D (SOIC) package from TLV4316-Q1 pinout diagram in the Pin Configurations and Functions sectionGo
  • Changed the ESD Ratings table from commercial to automotive specifications Go
  • Changed the CDM ESD rating from ±1500 to ±750 in the ESD Ratings table Go
  • Deleted the DCK (SC70) package from the Thermal Information: TLV316-Q1 table in the Specifications sectionGo
  • Changed the formatting of all Thermal Information table notes Go
  • Deleted the D (SOIC) package from the Thermal Information: TLV2316-Q1 table in the Specifications sectionGo
  • Deleted the D (SOIC) package from the Thermal Information: TLV4316-Q1 table in the Specifications section Go
  • Deleted the static literature number in the SBOA128 application note reference in the EMI Susceptibility and Input Filtering sectionGo
  • Deleted the static literature number in document reference in the Layout Guidelines section Go
  • Changed the layout example image (Figure 41) in Layout Example sectionGo
  • Deleted the static literature numbers from document references in Related Documentation section Go