SBASA91 December   2020 TLV320ADC3120

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 7.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 7.10 Timing Requirements: PDM Digital Microphone Interface
    11. 7.11 Switching Characteristics: PDM Digial Microphone Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3 Input Channel Configurations
      4. 8.3.4 Reference Voltage
      5. 8.3.5 Programmable Microphone Bias
      6. 8.3.6 Signal-Chain Processing
        1. 8.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.6.2 Programmable Channel Gain Calibration
        3. 8.3.6.3 Programmable Channel Phase Calibration
        4. 8.3.6.4 Programmable Digital High-Pass Filter
        5. 8.3.6.5 Programmable Digital Biquad Filters
        6. 8.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.6.7 Configurable Digital Decimation Filters
          1. 8.3.6.7.1 Linear Phase Filters
            1. 8.3.6.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.6.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.6.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.6.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.6.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.6.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.6.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 8.3.6.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 8.3.6.7.1.9 Sampling Rate 768 kHz or 705.6 kHz
          2. 8.3.6.7.2 Low-Latency Filters
            1. 8.3.6.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.6.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.6.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.6.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.6.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.6.7.2.6 Sampling Rate 192 kHz or 176.4 kHz
          3. 8.3.6.7.3 Ultra-Low Latency Filters
            1. 8.3.6.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.6.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.6.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.6.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.6.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.6.7.3.6 Sampling Rate 192 kHz or 176.4 kHz
            7. 8.3.6.7.3.7 Sampling Rate 384 kHz or 352.8 kHz
      7. 8.3.7 Automatic Gain Controller (AGC)
      8. 8.3.8 Digital PDM Microphone Record Channel
      9. 8.3.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode or Software Shutdown
      2. 8.4.2 Active Mode
      3. 8.4.3 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 TLV320ADC3120 Access Codes
      2. 8.6.2 Page 0 Registers
      3. 8.6.3 Page 1 Registers
      4. 8.6.4 Programmable Coefficient Registers
        1. 8.6.4.1 Programmable Coefficient Registers: Page 2
        2. 8.6.4.2 Programmable Coefficient Registers: Page 3
        3. 8.6.4.3 Programmable Coefficient Registers: Page 4
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Two-Channel Analog Microphone Recording
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Four-Channel Digital PDM Microphone Recording
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Example Device Register Configuration Script for EVM Setup
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-61BFF8CC-EB03-45C6-9D31-24DB2A4022E0-low.gifFigure 6-1 RTE Package,20-Pin WQFN With Exposed Thermal Pad,Top View
Table 6-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 IN1P Analog input Analog input 1P pin
2 IN1M Analog input Analog input 1M pin
3 IN2P_GPI1 Analog input/digital input Analog input 2P pin or general-purpose digital input 1 (multipurpose functions such as digital microphones data, PLL input clock source, and so forth)
4 IN2M_GPO1 Analog input/digital output Analog input 2M pin or general-purpose digital output 1 (multipurpose functions such as digital microphone clock, interrupt, and so forth)
5 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. Refer package drawing in the datasheet for this corner pin dimensions
6 SDOUT Digital output Audio serial data interface bus output
7 BCLK Digital I/O Audio serial data interface bus bit clock
8 FSYNC Digital I/O Audio serial data interface bus frame synchronization signal
9 IOVDD Digital supply Digital I/O power supply (1.8 V or 3.3 V, nominal)
10 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. Refer package drawing in the datasheet for this corner pin dimensions
11 GPIO1 Digital I/O General-purpose digital input/output 1 (multipurpose functions such as digital microphones clock or data, PLL input clock source, interrupt, and so forth)
12 SDA Digital I/O Data pin for I2C control bus
13 SCL Digital input Clock pin for I2C control bus
14 DREG Digital supply Digital regulator output voltage for digital core supply (1.5 V, nominal). Connect a 10 µF and 0.1 µF low ESR capacitors in parallel to device ground (VSS)
15 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. Refer package drawing in the datasheet for this corner pin dimensions
16 AVDD Analog supply Analog power (1.8 V or 3.3 V, nominal)
17 AREG Analog supply Analog on-chip regulator output voltage for analog supply (1.8 V, nominal) or external analog power (1.8 V, nominal). Connect a 10 µF and 0.1 µF low ESR capacitors in parallel to analog ground (AVSS)
18 VREF Analog Analog reference voltage filter output. Connect a 1 µF to analog ground (AVSS)
19 MICBIAS_GPI2 Analog output/digital input MICBIAS output or general-purpose digital input 2 (multipurpose functions such as digital microphones data, PLL input clock source, and so forth). If used as MICBIAS output, then connect a 1 µF to analog ground (AVSS)
20 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. Refer package drawing in the datasheet for this corner pin dimensions
Thermal Pad Thermal Pad (VSS) Ground supply Thermal pad shorted to internal device ground. Short the thermal pad directly to the board ground plane.