SBASA91 December   2020 TLV320ADC3120

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 7.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 7.10 Timing Requirements: PDM Digital Microphone Interface
    11. 7.11 Switching Characteristics: PDM Digial Microphone Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3 Input Channel Configurations
      4. 8.3.4 Reference Voltage
      5. 8.3.5 Programmable Microphone Bias
      6. 8.3.6 Signal-Chain Processing
        1. 8.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.6.2 Programmable Channel Gain Calibration
        3. 8.3.6.3 Programmable Channel Phase Calibration
        4. 8.3.6.4 Programmable Digital High-Pass Filter
        5. 8.3.6.5 Programmable Digital Biquad Filters
        6. 8.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.6.7 Configurable Digital Decimation Filters
          1. 8.3.6.7.1 Linear Phase Filters
            1. 8.3.6.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.6.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.6.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.6.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.6.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.6.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.6.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 8.3.6.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 8.3.6.7.1.9 Sampling Rate 768 kHz or 705.6 kHz
          2. 8.3.6.7.2 Low-Latency Filters
            1. 8.3.6.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.6.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.6.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.6.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.6.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.6.7.2.6 Sampling Rate 192 kHz or 176.4 kHz
          3. 8.3.6.7.3 Ultra-Low Latency Filters
            1. 8.3.6.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.6.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.6.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.6.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.6.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.6.7.3.6 Sampling Rate 192 kHz or 176.4 kHz
            7. 8.3.6.7.3.7 Sampling Rate 384 kHz or 352.8 kHz
      7. 8.3.7 Automatic Gain Controller (AGC)
      8. 8.3.8 Digital PDM Microphone Record Channel
      9. 8.3.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode or Software Shutdown
      2. 8.4.2 Active Mode
      3. 8.4.3 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 TLV320ADC3120 Access Codes
      2. 8.6.2 Page 0 Registers
      3. 8.6.3 Page 1 Registers
      4. 8.6.4 Programmable Coefficient Registers
        1. 8.6.4.1 Programmable Coefficient Registers: Page 2
        2. 8.6.4.2 Programmable Coefficient Registers: Page 3
        3. 8.6.4.3 Programmable Coefficient Registers: Page 4
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Two-Channel Analog Microphone Recording
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Four-Channel Digital PDM Microphone Recording
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Example Device Register Configuration Script for EVM Setup
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Programmable Microphone Bias

The device integrates a built-in, low-noise microphone bias pin that can be used in the system for biasing electret-condenser microphones or providing the supply to the MEMS analog or digital microphone. The integrated bias amplifier supports up to 20 mA of load current that can be used for multiple microphones and is designed to provide a combination of high PSRR, low noise, and programmable bias voltages to allow the biasing to be fine tuned for specific microphone combinations.

When using this MICBIAS pin for biasing or supplying to multiple microphones, avoid any common impedance on the board layout for the MICBIAS connection to minimize coupling across microphones. Table 8-11 shows the available microphone bias programmable options.

Table 8-11 MICBIAS Programmable Settings
P0_R59_D[6:4] : MBIAS_VAL[2:0] P0_R59_D[1:0] : ADC_FSCALE[1:0] MICBIAS OUTPUT VOLTAGE
000 (default) 00 (default) 2.75 V (same as the VREF output)
01 2.5 V (same as the VREF output)
10 1.375 V (same as the VREF output)
001 00 (default) 3.014 V (1.096 times the VREF output)
01 2.740 V (1.096 times the VREF output)
10 1.507 V (1.096 times the VREF output)
010 to 101 XX Reserved (do not use these settings)
110 XX Same as AVDD
111 XX Reserved (do not use this setting)

The microphone bias output can be powered on or powered off (default) by configuring the MICBIAS_PDZ, P0_R117_D7 register bit. Additionally, the device provides an option to configure the GPIO1 or GPIx pin to directly control the microphone bias output powering on or off. This feature is useful to control the microphone directly without engaging the host for I2C communication. The MICBIAS_PDZ, P0_R117_D7 register bit value is ignored if the GPIO1 or GPIx pin is configured to set the microphone bias on or off.