SNVSB04B March   2019  – June 2020 TLV4021 , TLV4031 , TLV4041 , TLV4051

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      TLV40x1 Configurations
  4. Revision History
  5. Pin Configuration and Functions
    1.     DSBGA Package Pin Functions
    2.     SOT-23 Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power ON Reset (POR)
      2. 7.4.2 Input (IN)
      3. 7.4.3 Switching Thresholds and Hysteresis (VHYS)
      4. 7.4.4 Output (OUT)
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Monitoring (V+)
      2. 8.1.2 Monitoring a Voltage Other than (V+)
      3. 8.1.3 VPULLUP to a Voltage Other than (V+)
    2. 8.2 Typical Application
      1. 8.2.1 Under-Voltage Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Additional Application Information
        1. 8.2.2.1 Pull-up Resistor Selection
        2. 8.2.2.2 Input Supply Capacitor
        3. 8.2.2.3 Sense Capacitor
    3. 8.3 What to Do and What Not to Do
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.