SNVSB04B March   2019  – June 2020 TLV4021 , TLV4031 , TLV4041 , TLV4051

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      TLV40x1 Configurations
  4. Revision History
  5. Pin Configuration and Functions
    1.     DSBGA Package Pin Functions
    2.     SOT-23 Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power ON Reset (POR)
      2. 7.4.2 Input (IN)
      3. 7.4.3 Switching Thresholds and Hysteresis (VHYS)
      4. 7.4.4 Output (OUT)
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Monitoring (V+)
      2. 8.1.2 Monitoring a Voltage Other than (V+)
      3. 8.1.3 VPULLUP to a Voltage Other than (V+)
    2. 8.2 Typical Application
      1. 8.2.1 Under-Voltage Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Additional Application Information
        1. 8.2.2.1 Pull-up Resistor Selection
        2. 8.2.2.2 Input Supply Capacitor
        3. 8.2.2.3 Sense Capacitor
    3. 8.3 What to Do and What Not to Do
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC (1) TLV40x1 UNIT
YKA (DSBGA) SOT-23 (DBV)
4 BUMPS 5 PINS
RθJA Junction-to-ambient thermal resistance 205.5 181.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.8 101.1 °C/W
RθJB Junction-to-board thermal resistance 75.3 52.0 °C/W
ψJT Junction-to-top characterization parameter 0.9 28.2 °C/W
ψJB Junction-to-board characterization parameter 74.7 51.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.