SBOS817I June   2017  – August 2021 TLV6741 , TLV6742

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Electrical Characteristics
    7. 7.7 TLV6741: Typical Characteristics
    8. 7.8 TLV6742: Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 THD+ Noise Performance
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
      5. 8.3.5 Electrical Overstress
      6. 8.3.6 Typical Specifications and Distributions
      7. 8.3.7 Shutdown Function
      8. 8.3.8 Packages With an Exposed Thermal Pad
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Single-Supply Electret Microphone Preamplifier With Speech Filter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information for Single Channel

THERMAL METRIC (1) TLV6741 UNIT
DCK
(SC70)
5 PINS
RθJA Junction-to-ambient thermal resistance 240.9 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 151.7 ℃/W
RθJB Junction-to-board thermal resistance 64 ℃/W
ψJT Junction-to-top characterization parameter 34.8 ℃/W
ψJB Junction-to-board characterization parameter 63.3 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report SPRA953C.