SLVSDM5F September   2017  – March 2020 TLV7011 , TLV7012 , TLV7021 , TLV7022

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      X2SON Package vs SC70 and US Dime
      2.      Propagation Delay vs. Overdrive
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: TLV7012/22
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings (Single)
    2. 6.2  Absolute Maximum Ratings (Dual)
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions (Single)
    5. 6.5  Recommended Operating Conditions (Dual)
    6. 6.6  Thermal Information (Single)
    7. 6.7  Thermal Information (Dual)
    8. 6.8  Electrical Characteristics (Single)
    9. 6.9  Switching Characteristics (Single)
    10. 6.10 Electrical Characteristics (Dual)
    11. 6.11 Switching Characteristics (Dual)
    12. 6.12 Timing Diagrams
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inverting Comparator With Hysteresis for TLV701x
      2. 8.1.2 Noninverting Comparator With Hysteresis for TLV701x
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IR Receiver Analog Front End
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Square-Wave Oscillator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DPW Package
5-Pin X2SON
Top View
TLV7011 TLV7021 TLV7012 TLV7022 DPW_pin_diagram.gif
DBV and DCK Package
5-Pin SOT-23 and SC70
Top View
TLV7011 TLV7021 TLV7012 TLV7022 po_3201_dck_dbv_bos561.gif

Pin Functions

PIN I/O/P(1) DESCRIPTION
NAME X2SON SOT-23, SC70
OUT 1 1 O Output
VCC 2 5 P Positive (highest) power supply
VEE 3 2 P Negative (lowest) power supply
IN– 4 4 I Inverting input
IN+ 5 3 I Noninverting input
(1) I = Input, O = Output, P = Power
TLV7012/22 DGK, DDF Packages
8-Pin VSSOP, SOT-23
Top View
TLV7011 TLV7021 TLV7012 TLV7022 VSSOP8.gif
TLV7012/22 DSG Package
8-Pin WSON With Exposed Thermal Pad
Top View
TLV7011 TLV7021 TLV7012 TLV7022 WSON8.gif
1. Connect thermal pad to V–.

Pin Functions: TLV7012/22

PIN I/O DESCRIPTION
NAME NO.
INA– 2 I Inverting input, channel A
INA+ 3 I Noninverting input, channel A
INB– 6 I Inverting input, channel B
INB+ 5 I Noninverting input, channel B
OUTA 1 O Output, channel A
OUTB 7 O Output, channel B
VEE 4 — Negative (lowest) supply or ground (for single-supply operation)
VCC 8 — Positive (highest) supply