SLVSAG6D September   2010  – July 2019 TLV702

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Consideration
      2. 10.1.2 Package Mounting
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Typical Characteristics

Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ = 25°C.
TLV702 tc_line_reg_10ma_lvsag6.gif
Figure 1. Line Regulation
TLV702 tc_load_reg_lvsag6.gif
Figure 3. Load Regulation
TLV702 tc_vdo_iout_lvsag6.gif
Figure 5. Dropout Voltage vs Output Current
TLV702 tc_ignd_vin_lvsag6.gif
Figure 7. Ground Pin Current vs Input Voltage
TLV702 tc_ignd-tmp_lvsag6.gif
Figure 9. Ground Pin Current vs Temperature
TLV702 tc_ilim-vin_lvsag6.gif
Figure 11. Current Limit vs Input Voltage
TLV702 tc_psrr-vin_lvsag6.gif
Figure 13. Power-Supply Ripple Rejection vs Input Voltage
TLV702 tc_load_tran_200_lvsag6.gif
Figure 15. Load Transient Response
TLV702 tc_load_tran_50_lvsag6.gif
Figure 17. Load Transient Response
TLV702 tc_line_tran_300ma_lvsag6.gif
Figure 19. Line Transient Response
TLV702 tc_line_tran_55v_lvsag6.gif
Figure 21. Line Transient Response
TLV702 tc_line_reg_300ma_lvsag6.gif
Figure 2. Line Regulation
TLV702 tc_vdo_vin_lvsag6.gif
Figure 4. Dropout Voltage vs Input Voltage
TLV702 tc_vout-tmp_lvsag6.gif
Figure 6. Output Voltage vs Temperature
TLV702 tc_ignd_iout_lvsag6.gif
Figure 8. Ground Pin Current vs Load
TLV702 tc_ishdn-vin_lvsag6.gif
Figure 10. Shutdown Current vs Input Voltage
TLV702 tc_psrr_fqcy_05v_lvsa00.gif
Figure 12. Power-Supply Ripple Rejection vs Frequency
TLV702 tc_noise-frq_lvsag6.gif
Figure 14. Output Spectral Noise Density vs Frequency
TLV702 tc_load_tran_10_lvsag6.gif
Figure 16. Load Transient Response
TLV702 tc_load_tran_300_lvsag6.gif
Figure 18. Load Transient Response
TLV702 tc_line_tran_1ma_lvsag6.gif
Figure 20. Line Transient Response
TLV702 tc_ramp_up_down_lvsag6.gif
Figure 22. VIN Ramp Up, Ramp Down Response