SBVS153F February   2011  – May 2018 TLV707 , TLV707P

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage
        3. 8.2.2.3 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Package Mounting
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from E Revision (February 2016) to F Revision

  • Changed V(ESD) HBM value from ±2000 V to ±4000 V in ESD Ratings tableGo

Changes from D Revision (January 2015) to E Revision

  • Changed device name to TLV707, TLV707P and changed VIN, VOUT(nom), IOUT symbols throughout documentGo
  • Changed DQN package designator name in Package Features bullet Go
  • Changed Applications bullets Go
  • Deleted first sentence from last paragraph of Description section Go
  • Changed caption of front-page figure Go
  • Changed Thermal Information tableGo
  • Changed TA to TJ in conditions of Electrical Characteristics table Go
  • Deleted temperature test conditions from VOUT parameter in Electrical Characteristics table Go
  • Deleted UVLO parameter from Electrical Characteristics table Go
  • Deleted UVLO block from Figure 58Go
  • Added cross-reference for Equation 1Go
  • Changed Device Functional Modes section Go
  • Deleted Undervoltage Lockout (UVLO) section Go
  • Changed title of Figure 59Go
  • Added cross-reference for Table 1Go
  • Added cross-reference for Figure 68Go

Changes from C Revision (November 2012) to D Revision

  • Changed references to DFN (SON) package to DQN (X2SON) throughout document Go
  • Changed Features list bullets Go
  • Changed fourth paragraph of Description section Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed Pin Descriptions table contents Go
  • Changed Overview section Go
  • Changed Internal Current Limit section Go
  • Changed Input and Output Capacitor Requirements section Go

Changes from B Revision (October 2011) to C Revision

  • Changed voltage range in fourth Features bulletGo
  • Changed front page pinout drawingGo
  • Changed Output voltage range parameter minimum specification in Electrical Characteristics tableGo
  • Changed DC output accuracy parameter test conditions in Electrical Characteristics tableGo
  • Changed voltage range in footnote 2 of Ordering Information tableGo

Changes from A Revision (August 2011) to B Revision

  • Deleted reference to DCK package from FeaturesGo
  • Deleted DCK package pinout drawingGo
  • Deleted column for DCK package from Pin Descriptions tableGo
  • Deleted DCK package from Thermal Information tableGo

Changes from * Revision (February 2011) to A Revision

  • Added footnote to Features to show available voltage optionsGo
  • Added preview banner over DCK pinout drawingGo