SBVS195F September   2012  – August 2019 TLV713

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      Dropout Voltage vs Output Current
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Considerations
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Transient Response
      4. 8.1.4 UVLO Circuit Limitation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Power Dissipation
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (March 2015) to F Revision

  • Added last sentence to Undervoltage Lockout (UVLO) sectionGo
  • Added UVLO Circuit Limitation section Go

Changes from D Revision (July 2013) to E Revision

  • Changed format to meet latest data sheet standards; added new sections, and moved existing sectionsGo
  • Changed Features bullet about device package options Go
  • Changed front-page figure Go
  • Changed Pin Configuration and Functions section; updated table formatGo
  • Changed Absolute Maximum Ratings table conditionsGo
  • Changed Output voltage range and Junction temperature range parameter maximum specifications in Absolute Maximum Ratings table Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Corrected DBV data in Thermal Information tableGo
  • Changed conditions of Electrical Characteristics table: changed VIN to VIN(nom); changed TA to TJ; corrected operating temperature range Go
  • Changed TA to TJ and 85°C to 125°C throughout Electrical Characteristics table Go
  • Added test conditions for line regulation parameter Go
  • Changed VDO parameter in Electrical Characteristics table: all rows changed Go
  • Changed Vn parameter typical specification in Electrical Characteristics table Go
  • Deleted TJ parameter from Electrical Characteristics table Go
  • Added TJ condiiton to ILIM parameter in Electrical Characteristics table for clarification Go
  • Changed Typical Characteristics conditionsGo
  • Changed Figure 1 through Figure 11 in Typical Characteristics to show improved performance definition Go
  • Added new Figure 3Go
  • Changed Figure 4Go
  • Changed Figure 5Go
  • Changed Figure 9 graph and figure titleGo
  • Added new Figure 10Go
  • Changed Figure 12; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 13; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 14; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 15; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 17; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 19; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 21; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 22; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Figure 23; corrected notation on axis titles to show units per graph division (units/div)Go
  • Changed Shutdown section: clarified description Go
  • Changed Foldback Current Limit section: adjusted flow and clarified descriptionGo
  • Changed paragraph 1 of Thermal ProtectionGo
  • Changed Table 2Go
  • Moved Ordering Information to Device Nomenclature section Go

Changes from C Revision (July 2013) to D Revision

  • Changed document status from Mixed Status to Production DataGo
  • Deleted DPW package from documentGo
  • Deleted reference to DPW package from last sentence of Description sectionGo
  • Deleted DPW pin out drawing from front-page graphicGo
  • Deleted footnote for page 1 graphicGo
  • Deleted DPW pinout drawing from Pin Configurations sectionGo
  • Deleted reference to DPW package from Pin Descriptions tableGo
  • Deleted DPW data from Thermal Information tableGo
  • Deleted footnote 3 of Ordering Information tableGo

Changes from B Revision (December 2012) to C Revision

  • Changed last Features bulletGo
  • Added Typical Application CircuitGo
  • Changed last two rows of the VDO parameter in the Electrical Characteristics tableGo

Changes from A Revision (October 2012) to B Revision

  • Changed footnote for page 1 graphicGo
  • Added DBV data to Thermal Information tableGo
  • Changed footnote 3 of Ordering Information tableGo

Changes from * Revision (September 2012) to A Revision

  • Reordered Features bulletsGo
  • Changed dropout range in fourth Features bulletGo
  • Changed Package and Fixed-Output Voltage Features bulletsGo
  • Added second and third paragraphs to Description sectionGo
  • Updated DQN pin out drawingGo
  • Changed DQN pinout caption in Pin Configurations sectionGo
  • Changed 1.2 V to 0.9 V in description of EN pin in Pin Descriptions tableGo
  • Changed DQN header row in Thermal Information tableGo
  • Changed VOUT maximum specification in Electrical Characteristics tableGo
  • Combined all VDO rows together in Electrical Characteristics tableGo
  • Changed VDO specifications in Electrical Characteristics tableGo
  • Changed ISHDN test conditions in Electrical Characteristics tableGo
  • Changed Typical Characteristics conditionsGo
  • Added curvesGo
  • Changed junction temperature range in second paragraph of Overview sectionGo
  • Updated Figure 24Go
  • Deleted third paragraph from Thermal Information sectionGo
  • Changed second paragraph of Input and Output Capacitor Considerations sectionGo
  • Deleted curve reference from Dropout Voltage sectionGo