SBVS310C July   2017  – June 2019 TLV743P

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      Dropout Voltage vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown and Output Enable
      3. 7.3.3 Internal Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Power Dissipation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DQN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (March 2018) to C Revision

  • Changed description of EN pin in Pin Functions tableGo
  • Deleted typical specification from VEN(HI) and VEN(LO) parameters Go
  • Added maximum specification to ILIM parameter Go
  • Added condition to 1-V Load Regulation vs IOUT and Temperature figureGo
  • Added condition to 1.8-V Load Regulation vs IOUT and Temperature figureGo
  • Added condition to 3.3-V Load Regulation vs IOUT and Temperature figure Go
  • Added condition to 1.2-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added condition to 1.8-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added condition to 3.3-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added and Output Enable to title and changed first paragraph of Shutdown and Output Enable sectionGo
  • Added DBV package to Maximum Ambient Temperature vs Device Power Dissipation figure and text referenceGo
  • Added (3) to Device Nomenclature tableGo

Changes from A Revision (January 2018) to B Revision

  • Changed X2SON package from preview to production data (active) Go

Changes from * Revision (July 2017) to A Revision

  • Added X2SON package to Features list Go
  • Added DQN (X2SON) package to Description section Go
  • Added X2SON package to Device Information tableGo
  • Added DQN (X2SON) package pinout drawing and pin functions table to Pin Configuration and Functions section Go
  • Deleted thermal pad from DBV pinout drawing and Pin Functions table Go
  • Changed format of I/O column contents and order of packages in Pin Functions table Go
  • Added DQN (X2SON) thermal information to Thermal Information table Go
  • Changed condition text for Figure 31Go
  • Added X2SON layout example image to Layout Examples section Go